Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects

被引：40

作者：

Dhananjay, Krithika ^{[1
]}

Shukla, Prachi ^{[2
]}

Pavlidis, Vasilis F. ^{[3
]}

Coskun, Ayse ^{[2
]}

Salman, Emre ^{[1
]}

机构：

[1] SUNY Stony Brook, Dept Elect & Comp Engn, Stony Brook, NY 11794 USA

[2] Boston Univ, Dept Elect & Comp Engn, Boston, MA 02215 USA

[3] Univ Manchester, Dept Comp Sci, Manchester M13 9PL, Lancs, England

来源：

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS | 2021年 / 68卷 / 03期

基金：

美国国家科学基金会;

关键词：

Three-dimensional displays; Two dimensional displays; Transistors; Tools; Integrated circuits; Fabrication; Through-silicon vias; Three-dimensional integrated circuits; monolithic integrated circuits; through-silicon vias; fabrication; physical design; thermal management; testing; neural networks; security; computer applications; TEST CHALLENGES; OPTIMIZATION; PERFORMANCE; METHODOLOGY; DESIGN;

D O I：

10.1109/TCSII.2021.3051250

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Monolithic 3D integration technology has emerged as an alternative candidate to conventional transistor scaling. Unlike conventional processes where multiple metal layers are fabricated above a single transistor layer, monolithic 3D technology enables multiple transistor layers above a single substrate. By providing vertical interconnects with physical dimensions similar to conventional metal vias, monolithic 3D technology enables unprecedented integration density and high bandwidth communication, which plays a critical role for various data-centric applications. Despite growing number of research efforts on various aspects of monolithic 3D integration, commercial monolithic 3D ICs do not yet exist. This tutorial brief provides a concise overview of monolithic 3D technology, highlighting important results and future prospects. Several applications that can potentially benefit from this technology are also discussed.

引用

页码：837 / 843

页数：7

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