Tensile characteristics of Sn-5wt%Sb-1.5wt%Ag reinforced by nano-sized ZnO particles

被引：3
作者：
Mansour, M. M. [1 ]
Fawzy, A. [1 ]
Wahab, L. A. [2 ]
Saad, G. [1 ]
机构：
[1] Ain Shams Univ, Dept Phys, Fac Educ, Cairo, Egypt
[2] Natl Ctr Radiat Res & Technol, Dept Phys, Cairo, Egypt
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2019年 / 30卷 / 05期
关键词：
MECHANICAL-PROPERTIES; IMPRESSION CREEP; SOLDER JOINTS; MICROSTRUCTURE; BEHAVIOR; NANOPARTICLES; CU; TEMPERATURE; ADDITIONS; STRENGTH;
D O I：
10.1007/s10854-019-00777-4
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study the impact of adding 0.3wt% ZnOnano-sized particles into Sn-5wt%Sb-1.5wt%Ag (SSA) lead free solder (LFS) was investigated for microstructure, thermal and tensile stress strain characteristics. The microstructure of both the plain and composite LFS was examined by utilizing the optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD). The addition of ZnOnano-sized particles drastically changed the microstructure and improved the tensile response of SSA LFS. The microstructure investigations showed the formation of the intermetallic compounds (IMCs) Ag3Sn and SnSb. Sizes of the formed IMCs were found finer in the ZnO-contained solder. In this work the alloy under investigation exhibited better tensile response with the refined IMC particle. Thermal analysis of the composite solder revealed a slight decrease (0.08 degrees C) in freezing point, low pasty range (6.55 degrees C) and low degree of undercooling (3.39 degrees C). These findings are expected to supply a correct guideline and reference in producing of electronic packages.
引用
收藏
页码：4831 / 4841
页数：11
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