Reliability aspects of electronic devices for advanced requirements

Purpose - This paper aims to detail the qualification of alternative substrate materials and reliability aspects for quad flat no lead (QFN) packages for highly stressed electronic devices, e.g. for use in automotive applications. Design/methodology/approach - Detailed information is given on the advanced climatic and mechanical requirements that electronic devices have to withstand during life cycle testing to qualify for the automotive industry. Studies on the suitability of high-temperature thermoplastics as substrate materials for printed circuit boards and the qualification of QFN packages for advanced requirements are described. In addition, information on cause-effect relationships between thermal and vibration testing are given. Findings - With respect to adhesion of metallization on high-temperature thermoplastics and the long-term stability of the solder joints, these substrate materials offer potential for use in electronic devices for advanced requirements. In addition, the long-term stability of the solder joints of QFN packages depends on the design of the landings on the PCB and the separation process of the components during manufacturing. Research limitations/implications - The paper covers only a selection of possible high-temperature thermoplastic materials that can be used in electronics production. Also, this paper has a focus on the new packaging type, QFN, in the context of qualification and automotive standards. Originality/value - The paper details the requirements electronic devices have to meet to be qualified for the automotive industry. Therefore, this contribution has its value in giving information on possible substrate alternatives and the suitability for the usage of QFN components for highly stressed electronic devices.