CURING OF EPOXY RESIN EPIDIAN® 6 CONTAINING REACTIVE ORGANOSILICON FILLER - A DIFFERENTIAL SCANNING CALORIMETRY STUDY

被引：0

作者：

Mossety-Leszczak, Beata ^{[1
]}

Ostynska, Paulina ^{[1
]}

Dutkiewicz, Michal ^{[2
]}

Maciejewski, Hieronim ^{[2
,3
]}

Galina, Henryk ^{[1
]}

机构：

[1] Rzeszow Tech Univ, Wydzial Chem, Katedra Technol & Mat Chem, PL-35959 Rzeszow, Poland

[2] Adam Mickiewicz Univ, Wydzial Chem, Zaklad Chem Metaloorganicznej, PL-60780 Poznan, Poland

[3] Fundacja UAM, PL-61612 Poznan, Poland

来源：

POLIMERY | 2013年 / 58卷 / 03期

关键词：

epoxy resins; silsesquioxanes; curing reaction; TTT diagram; POLYHEDRAL OLIGOMERIC SILSESQUIOXANE; ORGANIC/INORGANIC HYBRID COMPOSITES; THERMOMECHANICAL PROPERTIES; CUBIC SILSESQUIOXANES; MECHANICAL-PROPERTIES; POSS-EPOXY; NANOCOMPOSITES; NETWORKS; MORPHOLOGY; KINETICS;

D O I：

暂无

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

The curing reaction of epoxy resin Epidian 6 with or without an addition of reactive filler, octakis-[(3-glycidoxypropyl)dimethylsiloxy]octasilsesquioxane (POSS-OG), was investigated using differential scanning calorimetry (DSc). The curing agent was 4,4'-diaminodiphenyl-methane (DDM). Based on the analysis of the thermograms recorded at different heating rates the kinetics of curing reactions in the examined systems was determined using the Model Free Kinetics method. The experimental results obtained by DSC isothermal analysis in the temperature range 60-160 degrees C, with temperature modulation TOPEM (R), were used to construct TTT (time-temperature-transformation) diagram for epoxy resin Epidian 6 compositions with or without POSS-OG.

引用

页码：212 / 218

页数：7

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