Cost-effective multichip module manufacture using passive substrate fault tolerance

被引：1
|
作者：
Peacock, C
Bolouri, H
Habiger, C
机构：
[1] UNIV HERTFORDSHIRE,CTR RES DEV & ENGN,HATFIELD AL10 9AB,HERTS,ENGLAND
[2] ETH ZURICH,ELECT LAB,ZURICH,SWITZERLAND
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1997年 / 20卷 / 03期
关键词：
fault tolerance; manufacturing yield; multichip modules;
D O I：
10.1109/96.618232
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The widespread use of multichip module (MCM) technology is currently restricted by high substrate cost, poor substrate yield and low quality level of mounted components: the known good die (KGD) problem, This paper examines three yield enhancing fault tolerance techniques suitable for use with conventional (passive) substrates with the aid of a generic processor-memory MCM architecture, The use of spare memory dies and a paged address space is shown to be a very effective solution to the KGD problem for this particular architecture.
引用
收藏
页码：320 / 326
页数：7
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