GaN-on-SOI: Monolithically Integrated All-GaN ICs for Power Conversion

被引:58
作者
Li, X. [1 ,2 ]
Amirifar, N. [1 ]
Geens, K. [1 ]
Zhao, M. [1 ]
Guo, W. [1 ]
Liang, H. [1 ]
You, S. [1 ]
Posthuma, N. [1 ]
De Jaeger, B. [1 ]
Stoffels, S. [1 ]
Bakeroot, B. [1 ]
Wellekens, D. [1 ]
Vanhove, B. [1 ]
Cosnier, T. [1 ]
Langer, R. [1 ]
Marcon, D. [1 ]
Groeseneken, G. [1 ,2 ]
Decoutere, S. [1 ]
机构
[1] IMEC, Leuven, Belgium
[2] Katholieke Univ Leuven, Dept Elect Engn, Leuven, Belgium
来源
2019 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2019年
关键词
D O I
10.1109/iedm19573.2019.8993572
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report the first comprehensive research about GaN power integrated circuits (ICs) on GaN-on-SOI (silicon-on-insulator). Specific stepped (Al)GaN superlattice buffer and highly robust deep trench isolation are developed. Various components including HEMT, metal-insulator-metal (MIM) capacitor, Schottky barrier diode (SBD), two-dimensional electron gas (2DEG) resistor, and resistor-transistor logic (RTL) are co-integrated, compatible with the p-GaN technology. Based on these achievements, 200 V GaN HEMT with integrated driver shows an extraordinary switching performance. A 48V-to-1V single-stage buck converter is realized using a GaN half-bridge with integrated on-chip drivers. Further, an all-GaN buck converter containing a smart control pulse-width modulation (PWM) circuit, dead-time control, drivers, and half-bridge is successfully designed using the GaN IC platform process design kit (PDK).
引用
收藏
页数:4
相关论文
共 8 条
[1]   Half-Bridge GaN Power ICs: Performance and Application [J].
Fichtenbaum, Nick ;
Giandalia, Marco ;
Sharma, Santosh ;
Zhang, Jason .
IEEE Power Electronics Magazine, 2017, 4 (03) :33-40
[2]   Suppression of the Backgating Effect of Enhancement-Mode p-GaN HEMTs on 200-mm GaN-on-SOI for Monolithic Integration [J].
Li, Xiangdong ;
Van Hove, Marleen ;
Zhao, Ming ;
Geens, Karen ;
Guo, Weiming ;
You, Shuzhen ;
Stoffels, Steve ;
Lempinen, Vesa-Pekka ;
Sormunen, Jaakko ;
Groeseneken, Guido ;
Decoutere, Stefaan .
IEEE ELECTRON DEVICE LETTERS, 2018, 39 (07) :999-1002
[3]   200 V Enhancement-Mode p-GaN HEMTs Fabricated on 200 mm GaN-on-SOI With Trench Isolation for Monolithic Integration [J].
Li, Xiangdong ;
Van Hove, Marleen ;
Zhao, Ming ;
Geens, Karen ;
Lempinen, Vesa-Pekka ;
Sormunen, Jaakko ;
Groeseneken, Guido ;
Decoutere, Stefaan .
IEEE ELECTRON DEVICE LETTERS, 2017, 38 (07) :918-921
[4]  
Reusch D, 2015, IEEE ENER CONV, P381, DOI 10.1109/ECCE.2015.7309713
[5]  
Risbud DM, 2016, 2016 IEEE 4TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), P176, DOI 10.1109/WiPDA.2016.7799933
[6]  
Ujita S, 2014, PROC INT SYMP POWER, P51, DOI 10.1109/ISPSD.2014.6855973
[7]   A GaN Pulse Width Modulation Integrated Circuit for GaN Power Converters [J].
Wang, Hanxing ;
Kwan, Alex Man Ho ;
Jiang, Qimeng ;
Chen, Kevin J. .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2015, 62 (04) :1143-1149
[8]  
Weiss B, 2017, 2017 IEEE 5TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), P265, DOI 10.1109/WiPDA.2017.8170558