Thermodynamic Comparison of Silicon Carbide CVD Process between CH3SiCl3-H2 and C3H8-SiCl4-H2 Systems

被引:6
作者
Choi, Kyoon [1 ]
Kim, Jun-Woo [1 ]
机构
[1] Korea Inst Ceram Engn & Technol, KICET Icheon Branch, Ichon 467843, South Korea
来源
KOREAN JOURNAL OF METALS AND MATERIALS | 2012年 / 50卷 / 08期
关键词
thin film; vapor deposition; phase diagram; thermodynamic calculation; computer simulation; CHEMICAL-VAPOR-DEPOSITION;
D O I
10.3365/KJMM.2012.50.8.569
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In order to understand the difference in SiC deposition between the CH3SiCl3-H-2 and C3H8SiCl4-H-2 systems, we calculate the phase stability among beta-sic, graphite and silicon. We constructed the phase-diagram of beta-SiC over graphite and silicon via computational thermodynamic calculation considering pressure (P), temperature (T) and gas composition (C) as variables. Both P-T-C diagrams showed a very steep phase boundary between the SiC+C and SiC region perpendicular to the H/Si axis, and also showed an SiC+Si region with a H/Si value of up to 6700 in the C3H8-SiCl4-H-2, and 5000 in the CH3SiCl3-H-2 system. This difference in phase boundaries is explained by the ratio of Cl to Si, which is 4 for the C3H8-SiCl4-H-2 system and 3 for the C3H8-SiCl4-H-2 system. Because the C/Si ratio is fixed at 1 in the CH3SiCl3-H-2 system while it can be variable in the C3H8-SiCl4-H-2 system, the functionally graded material is applicable for better mechanical bonding during SiC coating on graphite substrate in the C3H8-SiCl4-H-2 system.
引用
收藏
页码:569 / 573
页数:5
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