Modeling of Differential Line Referenced to a Meshed Ground Plane

被引:0
|
作者
Xiao, Fengchao [1 ]
Murano, Kimitoshi [2 ]
Kami, Yoshio [1 ]
机构
[1] Univ Electrocommun, Dept Commun Engn & Informat, Chofu, Tokyo 1828585, Japan
[2] Tokai Univ, Dept Elect & Elect Engn, Hiratsuka, Kanagawa 2591292, Japan
关键词
Meshed ground plane; diffeential line; crosstalk; equivalent model; multiconductor transmission line; PERFORATED REFERENCE PLANES; TRANSMISSION-LINES;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Meshed power and ground planes are quite common in flexible printed circuit board (PCB) and also found primarily in the multi-layered low temperature co-fired ceramic substrate. Transmission characteristics of a differential line referenced to a meshed ground plane is investigated in this work. The ABCD parameters for the differential line referenced to a meshed ground plane are described and an equivalent transmission line model in terms of the effective mode characteristic impedances and the effective mode propagation constants is proposed. The validity of the approach is confirmed through comparison with different test examples.
引用
收藏
页码:735 / 740
页数:6
相关论文
共 50 条
  • [21] Experimental Study on Common Mode Choke for Conducted Noise Reduction from Differential Line to Ground Plane
    Ueyama, Hiroya
    Iida, Naoki
    Kayano, Yoshiki
    Xiao, Fengchao
    Kami, Yoshio
    PROCEEDINGS OF THE 2024 IEEE JOINT INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY: EMC JAPAN/ASIAPACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, EMC JAPAN/APEMC OKINAWA 2024, 2024, : 453 - 456
  • [22] Modeling of striplines between a power and a ground plane
    Engin, A. Ege
    John, Werner
    Sommer, Grit
    Mathis, Wolfgang
    Reichl, Herbert
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (03): : 415 - 426
  • [23] Modeling and Analysis of Coupling in Gapped Ground Plane
    Leena, G.
    Mariappan, Rajeswari
    Salil, P.
    Subbarao, B.
    INCEMIC 2008: 10TH INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE AND COMPATIBILITY, PROCEEDINGS, 2008, : 579 - +
  • [24] Q-Factor Improvement of FR-4 Embeeded RF Inductors using Meshed Ground Plane
    Lee, Hwan Hee
    Park, Jae Yeong
    2007 ASIA PACIFIC MICROWAVE CONFERENCE, VOLS 1-5, 2007, : 160 - 163
  • [25] Mitigating differential skew by rotating meshed ground for high-density layout in flexible printed circuits
    Wang, Chenyu
    Iokibe, Kengo
    Toyota, Yoshitaka
    IEICE ELECTRONICS EXPRESS, 2020, 17 (10):
  • [26] On the Validity Limits of the Transmission Line Theory in Evaluating Differential-Mode Signals along a Two-Wire Line above a Ground Plane
    Mora, N.
    Lugrin, G.
    Rachidi, F.
    Junqua, I.
    Parmantier, J. P.
    Tkachenko, S.
    Rubinstein, M.
    Nyffeler, M.
    Bertholet, P.
    2015 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2015, : 797 - 800
  • [27] CLOSED-FORM EXPRESSIONS FOR THE CURRENT-DENSITY ON THE GROUND PLANE OF A MICROSTRIP LINE, WITH APPLICATION TO GROUND PLANE LOSS
    HOLLOWAY, CL
    KUESTER, EF
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1995, 43 (05) : 1204 - 1207
  • [28] Reduction in reflections and ground bounce for signal line through a split power plane by using differential coupled microstrip lines
    Shiue, GH
    Wu, RB
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, : 107 - 110
  • [29] Reduction in Reflections and Ground Bounce for Signal Line Over Slotted Power Plane Using Differential Coupled Microstrip Lines
    Shiue, Guang-Hwa
    Wu, Ruey-Beei
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (03): : 581 - 588
  • [30] ANALYSIS OF AN ARBITRARILY INCLINED SLOT ON THE GROUND PLANE OF A MICROSTRIP LINE
    ANTAR, YMM
    FAN, Z
    ITTIPIBOON, A
    ELECTRONICS LETTERS, 1995, 31 (23) : 1966 - 1967