Study of wetting reaction between eutectic AuSn and Au foil

被引：23

作者：

Lai, YT ^{[1
]}

Liu, CY ^{[1
]}

机构：

[1] Natl Cent Univ, Dept Chem Engn & Mat Engn, Chungli, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2006年 / 35卷 / 01期

关键词：

AuSn; wetting reactions; Au foil;

D O I：

10.1007/s11664-006-0180-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Wetting reactions between eutectic AuSn solder and Au foil have been studied. During the reflow process, Au foil dissolution occurred at the interface of AuSn/Au, which increases with temperature and time. The activation energy for Au dissolution in molten AuSn solder is determined to be 41.7 kJ/mol. Au5Sn is the dominant interfacial compound phase formed at the interface. The activation energy for the growth of interfacial Au5Sn phase layer is obtained to be 54.3 kJ/mol over the temperature range 360-440 degrees C. The best wettability of molten AuSn solder balls on Au foils occurred at 390 degrees C (wetting angle is about 25 degrees). Above 390 degrees C, the higher solder oxidation rate retarded the wetting of the molten AuSn solder.

引用

页码：28 / 34

页数：7

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