Interaction of two offset interfacial cracks in bonded dissimilar media with a functionally graded interlayer: Antiplane deformation

被引:9
作者
Choi, Hyung Jip [1 ]
机构
[1] Kookmin Univ, Sch Mech Syst Engn, Seoul 136702, South Korea
关键词
Bonded dissimilar media; Functionally graded interlayer; Interfacial cracks; Singular integral equations; Stress intensity factors; ARBITRARILY ORIENTED CRACK; HALF-PLANES; ANGLE;
D O I
10.1016/j.mechrescom.2012.06.008
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
This paper is concerned with the problem of bonded dissimilar, homogeneous media with a functionally graded interlayer, weakened by two offset interfacial cracks under antiplane deformation. Based on the Fourier integral transform method, formulation of the crack problem is reduced to a system of Cauchy-type singular integral equations. The mode III stress intensity factors are defined and evaluated in terms of the solution to the integral equations. Numerical results include the variations of stress intensity factors versus offset distance between the two cracks for various combinations of material and other geometric parameters of the bonded system, addressing the interaction of the two neighboring interfacial cracks spaced apart by the graded interlayer. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码:7 / 14
页数:8
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