Detailed investigation of ultrasonic Al-Cu wire-bonds: I. Intermetallic formation in the as-bonded state

被引:48
作者
Drozdov, M. [1 ]
Gur, G. [2 ]
Atzmon, Z. [2 ]
Kaplan, Wayne D. [1 ]
机构
[1] Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel
[2] Kulicke & Soffa Bonding Tools, Yokneam Elite, Israel
关键词
D O I
10.1007/s10853-008-2954-x
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Scanning and transmission electron microscopy were used to study intermetallic formation and the interface morphology in copper wire-bonds. The ends of copper wires were melted in air and in a protective environment to form wire-balls. The protective environment enabled formation of symmetrical and relatively defect-free copper balls, together with a smaller heat affected zone (in comparison with wires melted in air). Detailed morphological and compositional characterization of the Al-Cu as-bonded interface was conducted using scanning and transmission electron microscopy, on specimens prepared by focused ion beam milling. Discontinuous and non-uniform intermetallics were found in regions where high localized stress was introduced during the wire-bonding process. The main intermetallic phase was found to be Al2Cu.
引用
收藏
页码:6029 / 6037
页数:9
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