Enhanced solar cell performance of Cu2ZnSn(S,Se)4 thin films through structural control by using multi-metallic stacked nanolayers and fast ramping process for sulfo-selenization

被引:26
作者
Chen, Wei-Chao [1 ,2 ,3 ]
Chen, Cheng-Ying [3 ]
Tunuguntla, Venkatesh [1 ,3 ]
Lu, Shao Hung [4 ]
Su, Chaochin [4 ]
Lee, Chih-Hao [2 ]
Chen, Kuei-Hsien [1 ,3 ]
Chen, Li-Chyong [3 ]
机构
[1] Acad Sinica, Inst Atom & Mol Sci, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan
[2] Natl Tsing Hua Univ, Dept Engn & Syst Sci, 101,Sec 2,Kuang Fu Rd, Hsinchu 30013, Taiwan
[3] Natl Taiwan Univ, Ctr Condensed Matter Sci, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan
[4] Natl Taipei Univ Technol, Dept Mol Sci & Engn, Taipei 10617, Taiwan
关键词
CZTSSe; Thin films solar cells; Multi-metallic stacked precursor; CU2ZNSNS4; FILMS; FORMATION MECHANISM; SULFURIZATION; LAYERS;
D O I
10.1016/j.nanoen.2016.09.022
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In this paper, Cu2ZnSn(S,Se)(4) (CZTSSe) thin-films were prepared by sulfo-selenization of metal precursors in H2S environment instead of using metal selenides/sulfides as precursors. High quality CZTSSe thin films were obtained using multi-stacking metallic nanolayer precursors undergoing a fast ramping process. For the preparation of metallic stacked nanolayer precursors, we have developed a 9-layer sequential deposition of Sn/Zn/Cu metal stack onto Mo-coated soda lime glass substrate by RF-sputtering. Due to inevitable metal inter diffusion during the sulfo-selenization, we further studied the effect of the Sn/Zn/Cu metal stacking number (therefore, the layer thickness) on the quality of thin film with respect to its device performance. In the device prepared with conventional 3-layer stack, due to insufficient inter-diffusion of precursors, excessive Cu-rich secondary phase was formed at the back contact region and resulted in poor performance of devices. By using the modified 9-layer stacked precursor and fast ramping heating process the device efficiency can be improved from 4.9% to 7.7% and open circuit voltage from 0.44 to 0.5 V. This improvement can be ascribed to a compact, smooth microstructure, presence of bronze formation and the suppression of Cu-rich bi-layer formation in the 9-layer approach.
引用
收藏
页码:762 / 770
页数:9
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