Increasing the ductility of ultrafine-grained copper alloy by introducing fine precipitates

被引:58
作者
Takata, Naoki [1 ]
Ohtake, Yusuke [2 ]
Kita, Kazuhisa [2 ]
Kitagawa, Kazuo [2 ]
Tsuji, Nobuhiro [3 ]
机构
[1] Tokyo Inst Technol, Dept Met & Ceram Sci, Meguro Ku, Tokyo 1528552, Japan
[2] Kanazawa Univ, Dept Mech Syst Engn, Kanazawa, Ishikawa 9201192, Japan
[3] Osaka Univ, Dept Adapt Machine Syst, Suita, Osaka 5650871, Japan
关键词
Severe plastic deformation; Accumulative roll bonding; Mechanical property; Precipitation; Cu-Cr-Zr alloy; LOW-CARBON STEEL; ARB; STRENGTH;
D O I
10.1016/j.scriptamat.2008.12.018
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We fabricated ultrafine-grained (UFG) Cu-Cr-Zr alloy including fine second-phase particles via an accumulative roll-bonding process and subsequent aging treatment. The nanosized precipitates dispersed within the UFG matrix significantly enhanced strain hardening, resulting in the simultaneous improvement of uniform elongation and tensile strength. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:590 / 593
页数:4
相关论文
共 17 条
[1]  
Altan B. S., 2006, Severe Plastic Deformation: Toward Bulk Productions of Nanostructured Materials
[2]   Short-circuit diffusion in an ultrafine-grained copper-zirconium alloy produced by equal channel angular pressing [J].
Amouyal, Y. ;
Divinski, S. V. ;
Estrin, Y. ;
Rabkin, E. .
ACTA MATERIALIA, 2007, 55 (17) :5968-5979
[3]   Achieving high strength and high ductility in precipitation-hardened alloys [J].
Horita, Z ;
Ohashi, K ;
Fujita, T ;
Kaneko, K ;
Langdon, TG .
ADVANCED MATERIALS, 2005, 17 (13) :1599-+
[4]  
OOTAKE Y, 2007, J JRICU, V46, P142
[5]  
Saito S, 1998, JPN HEART J, V39, P221
[6]   Novel ultra-high straining process for bulk materials - Development of the accumulative roll-bonding (ARB) process [J].
Saito, Y ;
Utsunomiya, H ;
Tsuji, N ;
Sakai, T .
ACTA MATERIALIA, 1999, 47 (02) :579-583
[7]  
Suzuki H., 1972, Journal of the Japan Institute of Metals, V36, P363
[8]  
Suzuki H., 1969, J. Jpn. Inst. Met., V33, P628, DOI [10.2320/jinstmet1952.33.5628, DOI 10.2320/JINSTMET1952.33.5628]
[9]   Nanostructured bulk copper fabricated by accumulative roll bonding [J].
Takata, Naoki ;
Lee, Seong-Hee ;
Lim, Cha-Yong ;
Kim, Sang-Shik ;
Tsuji, Nobuhiro .
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2007, 7 (11) :3985-3989
[10]   Change in microstructure and texture during annealing of pure copper heavily deformed by accumulative roll bonding [J].
Takata, Naoki ;
Yamada, Kousuke ;
Ikeda, Ken-ichi ;
Yoshida, Fuyuki ;
Nakashima, Hideharu ;
Tsuji, Nobuhiro .
MATERIALS TRANSACTIONS, 2007, 48 (08) :2043-2048