Transfer printing of patterned metal films using parylene C coated surfaces

被引：6

作者：

Bavier, J. ^{[1
,2
]}

Cumings, J. ^{[1
]}

Hines, D. R. ^{[2
]}

机构：

[1] Univ Maryland, Dept Mat Sci & Engn, College Pk, MD 20742 USA

[2] Lab Phys Sci, College Pk, MD 20740 USA

来源：

MICROELECTRONIC ENGINEERING | 2013年 / 104卷

关键词：

Transfer printing; Flexible electronics; Surface treatments; SELF-ASSEMBLED MONOLAYERS; CONTACT-ANGLE; TRANSISTORS;

D O I：

10.1016/j.mee.2012.10.020

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Successful transfer printing of aluminum (Al), copper (Cu), silver (Ag), nickel (Ni) and gold (Au) films is demonstrated. Previously, Al, Cu, Ag, and Ni films have exhibited relatively strong adhesion to silicon (Si) substrates resulting in poor transfer printing results. To overcome this limitation, Si wafers were coated with parylene C before metals deposition. Surface energy calculations determined from contact angle measurements confirm parylene's suitability for the transfer printing process. Metal films were photolithographically pattemed onto parylene C coated Si wafers and then transfer printed onto either polyethylene naphthalene (PEN), polycarbonate (PC) or Kapton substrates. Resistance measurements were taken both before and after printing. Calculated resistivity values were close to bulk materials and no significant drop in resistivity was observed after printing, indicating that the printed metal films are of high quality. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：18 / 21

页数：4

共 19 条

[1] Inkjet printing using copper nanoparticles synthesized by electrolysis
Cheon, Jinmin
Lee, Jinha
Kim, Jongryoul
[J]. THIN SOLID FILMS, 2012, 520 (07) : 2639 - 2643
[2] STRESS IN THERMALLY ANNEALED PARYLENE FILMS
DABRAL, S
VANETTEN, J
ZHANG, X
APBLETT, C
YANG, GR
FICALORA, P
MCDONALD, JF
[J]. JOURNAL OF ELECTRONIC MATERIALS, 1992, 21 (10) : 989 - 994
[3] Gamota D., 2004, Printed organic and molecular electronics
[4] CONTACT-ANGLE, WETTING, AND ADHESION - A CRITICAL-REVIEW
GOOD, RJ
[J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1992, 6 (12) : 1269 - 1302
[5] Transfer printing methods for the fabrication of flexible organic electronics
Hines, D. R.
Ballarotto, V. W.
Williams, E. D.
Shao, Y.
Solin, S. A.
[J]. JOURNAL OF APPLIED PHYSICS, 2007, 101 (02)
[6] Nanotransfer printing of organic and carbon nanotube thin-film transistors on plastic substrates
Hines, DR
Mezhenny, S
Breban, M
Williams, ED
Ballarotto, VW
Esen, G
Southard, A
Fuhrer, MS
[J]. APPLIED PHYSICS LETTERS, 2005, 86 (16) : 1 - 3
[7] HINES DR, UNPUB
[8] Static solvent contact angle measurements, surface free energy and wettability determination of various self-assembled monolayers on silicon dioxide
Janssen, Dimitri
De Palma, Randy
Verlaak, Stijn
Heremans, Paul
Dehaen, Wim
[J]. THIN SOLID FILMS, 2006, 515 (04) : 1433 - 1438
[9] Microelectrode fabrication by laser direct curing of tiny nanoparticle self-generated from organometallic ink
Kang, Bongchul
Ko, Seunghwan
Kim, Jongsu
Yang, Minyang
[J]. OPTICS EXPRESS, 2011, 19 (03): : 2573 - 2579
[10] Lee JH, 2004, J KOREAN PHYS SOC, V44, P1177

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