Transfer printing of patterned metal films using parylene C coated surfaces

被引：7

作者：

Bavier, J. ^{[1
,2
]}

Cumings, J. ^{[1
]}

Hines, D. R. ^{[2
]}

机构：

[1] Univ Maryland, Dept Mat Sci & Engn, College Pk, MD 20742 USA

[2] Lab Phys Sci, College Pk, MD 20740 USA

来源：

MICROELECTRONIC ENGINEERING | 2013年 / 104卷

关键词：

Transfer printing; Flexible electronics; Surface treatments; SELF-ASSEMBLED MONOLAYERS; CONTACT-ANGLE; TRANSISTORS;

D O I：

10.1016/j.mee.2012.10.020

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Successful transfer printing of aluminum (Al), copper (Cu), silver (Ag), nickel (Ni) and gold (Au) films is demonstrated. Previously, Al, Cu, Ag, and Ni films have exhibited relatively strong adhesion to silicon (Si) substrates resulting in poor transfer printing results. To overcome this limitation, Si wafers were coated with parylene C before metals deposition. Surface energy calculations determined from contact angle measurements confirm parylene's suitability for the transfer printing process. Metal films were photolithographically pattemed onto parylene C coated Si wafers and then transfer printed onto either polyethylene naphthalene (PEN), polycarbonate (PC) or Kapton substrates. Resistance measurements were taken both before and after printing. Calculated resistivity values were close to bulk materials and no significant drop in resistivity was observed after printing, indicating that the printed metal films are of high quality. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：18 / 21

页数：4

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