Silver Surface Treatment of Cu(In,Ga)Se2(CIGS) Thin Film: A New Passivation Process for the CdS/CIGS Heterojunction Interface

被引:30
|
作者
Zhang, Yunxiang [1 ]
Hu, Zhaojing [1 ]
Lin, Shuping [1 ]
Wang, Chaojie [1 ]
Cheng, Shiqing [1 ]
He, Zhichao [1 ]
Zhou, Zhiqiang [1 ]
Sun, Yun [1 ]
Liu, Wei [1 ]
机构
[1] Nankai Univ, Inst Photoelectron Thin Film Devices & Technol, Minist Educ, Lab Photoelect Thin Film Devices & Technol,Tianji, Tianjin 300350, Peoples R China
基金
国家重点研发计划; 中国国家自然科学基金;
关键词
Ag surface treatment process; CIGS solar cells; hetero-junctions; interface engineering; CU-DEFICIENT LAYER; CIGS SOLAR-CELLS; POSTDEPOSITION TREATMENT; EFFICIENCY; CU(IN; AG; PERFORMANCE;
D O I
10.1002/solr.202000290
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
The interface engineering of Cu(In,Ga)Se-2(CIGS)-based solar cells is challenging for high-efficiency devices, especially for the CdS/CIGS heterojunction interface. Recently, post-treatment of the CIGS surface, as an efficient approach to passivate the defects at the CdS/CIGS interface, has attracted widespread attention. Here, a simple Ag surface treatment process is used to realize the passivation of interface defects and the enhancement of the CdS/CIGS heterojunction. This process not only reduces the surface roughness of CIGS films significantly, but also contributes to controlling the Ga composition in the surface layer. Furthermore, characterization techniques reveal that Ag surface treatment can effectively decrease the defect concentrations at the heterojunction interface and enhance the CdS/CIGS heterojunction quality with appropriate Ag deposition duration. Further investigations on the changed defect level caused by the Ag surface treatment indicate that the increased defect level is likely related to the shift of valence band maximum. Eventually, the efficiency of the optimum device has a relative increase of about 18% compared with that of the reference solar cell. This work focuses on revealing the differences of the CIGS surface and CdS/CIGS interface caused by Ag, which provides a new surface processing method for the passivation of the CdS/CIGS heterojunction.
引用
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页数:9
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