Crystallographic texture and whiskers in electrodeposited tin films

被引：27

作者：

Frye, Asa ^{[1
]}

Galyon, George T. ^{[1
]}

Palmer, Larry ^{[1
]}

机构：

[1] IBM Corp, Syst & Technol Div, Poughkeepsie, NY 12601 USA

来源：

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 2007年 / 30卷 / 01期

关键词：

electron backscatter diffraction; pole figures; texture; tin films;

D O I：

10.1109/TEPM.2007.891763

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electron back scatter diffraction (EBSD) analysis was used to determine texture for electrodeposited tin films, and the results were compared to standard X-ray "times random" and full pole figure texture analysis. The data showed that EBSD and X-ray texture results differed as to primary and secondary texture determinations with some degree of correlation between texture determinations when primary/secondary/tertiary calculations were disregarded. It is these authors' opinion that film texture cannot be accurately determined using "times random" X-ray diffraction (XRD) techniques, and that there is considerable room for error with X-ray pole figure analyses. These data must be considered preliminary due to the small sample size, but these results indicate that electroplaters; may have better control over as-deposited tin film texture than is currently believed, and that there is a relationship between as-deposited texture and film stress.

引用

页码：2 / 10

页数：9