GeSbTe deposition for the PRAM application

被引:75
作者
Lee, Junghyun
Choi, Sangjoon
Lee, Changsoo
Kang, Yoonho
Kim, Daeil
机构
[1] Univ Ulsan, Sch Mat Sci & Engn, Ulsan 680749, South Korea
[2] SAIT, Nano Fabricat Ctr, Suwon, South Korea
关键词
GeSbTe chalcogenide; ALD; TEM; AFM; XRD;
D O I
10.1016/j.apsusc.2006.08.044
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
GeSbTe (GST) chalcogenide thin films for the phase-change random access memory (PRAM) were deposited by an atomic layer deposition (ALD) process. New precursors for GST thin films made with an ALD process were synthesized. Among the synthesized precursors, Ge(N(CH3)(2))(4), Sb(N(CH3)(2))(4), and Te(i-Pr)(2) (i-Pr = iso-propyl) were selected. Using the above precursors, GST thin films were deposited using an H, plasma-assisted ALD process. Film resistivity abruptly changed after an N, annealing process above a temperature of 350 degrees C. Cross-sectional scanning electron microscope (SEM) photographs of the GST films on the patterned substrate with aspect ratio of 7 shows that the step coverage is about 90%. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:3969 / 3976
页数:8
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