Hot embossing as a method for the fabrication of polymer high aspect ratio structures

被引：513

作者：

Becker, H ^{[1
]}

Heim, U ^{[1
]}

机构：

[1] Jenopt Mikrotech, D-07745 Jena, Germany

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2000年 / 83卷 / 1-3期

关键词：

polymer microfabrication; hot embossing; microfluidics; mu-TAS;

D O I：

10.1016/S0924-4247(00)00296-X

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Polymer microfabrication methods are becoming increasingly important as low-cost alternatives to the silicon or glass-based MEMS technologies. We present in this paper the technology of hot embossing as a flexible, low-cost microfabrication method for polymer microstructures, which uses the replication of a micromachined embossing master to generate microstructures on a polymer substrate. With this fabrication technology high aspect ratio structures can be fabricated over large surface areas, which allows a commercially successful manufacturing of polymer microcomponents. (C) 2000 Elsevier Science S.A. All rights reserved.

引用

页码：130 / 135

页数：6

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