Fabrication and model validation for CMUTs operated in permanent contact mode

被引:4
作者
Ho, Min-Chieh [1 ]
Kupnik, Mario [2 ]
Vaithilingam, Srikant [1 ]
Khuri-Yakub, Butrus T. [1 ]
机构
[1] Stanford Univ, Stanford, CA 94305 USA
[2] Brandenburg Tech Univ Cottbus, Cottbus, Germany
来源
2011 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS) | 2011年
关键词
Fabrication; CMUT; permanent contact mode; wide pressure range; ultrasonic flow meter; thick BOX process;
D O I
10.1109/ULTSYM.2011.0249
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present the successful fabrication and finite element analysis (FEA) validation of capacitive micromachined ultrasonic transducers (CMUTs) targeting applications under a wide and varying pressure range (similar to 1-20 atm), such as ultrasonic flow metering (UFM). In our devices each plate is in permanent contact with the bottom of the cavity, even at zero d.c. bias voltage condition. The fabrication is based on a direct wafer bonding process (thick buried oxide layer process), which allows the realization of only partially connected bottom electrodes. The fabricated devices show measured performance in good agreement with FEA. The results for the measured plate profiles confirm the permanent contact and are within 3.5% of the static FEA results. Further, in comparison to laser vibrometer measurements, the FEA modal analysis predicts the 1st and 2nd mode frequencies for permanent contact devices within 3% and 1.5%, respectively. In addition, the overall trends of resonant frequency and contact radii as a function of d.c. bias voltage are both consistent with FEA. Our results show that the fabrication of CMUTs in permanent contact mode is feasible, and that FEA serves as an excellent tool for predicting and designing both the static and dynamic behavior of CMUTs operated in the permanent contact mode.
引用
收藏
页码:1016 / 1019
页数:4
相关论文
共 5 条
  • [1] Gulaga C., 2005, FLARE MEASUREMENT BE
  • [2] Ho Min-Chieh, 2010, Proc IEEE Ultrason Symp, V2010, P1234, DOI 10.1109/ULTSYM.2010.0315
  • [3] Kupnik Mario, 2010, Proc IEEE Ultrason Symp, V2010, P547, DOI 10.1109/ULTSYM.2010.0137
  • [4] Fabrication of Capacitive Micromachined Ultrasonic Transducers via Local Oxidation and Direct Wafer Bonding
    Park, Kwan Kyu
    Lee, Hyunjoo
    Kupnik, Mario
    Khuri-Yakub, Butrus T.
    [J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2011, 20 (01) : 95 - 103
  • [5] Finite-element analysis of capacitive micromachined ultrasonic transducers
    Yaralioglu, CG
    Ergun, AS
    Khuri-Yakub, BT
    [J]. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 2005, 52 (12) : 2185 - 2198