Influence of solid/liquid interfaces on the microstructure and stress-rupture life of the single-crystal nickel-base superalloy NASAIR 100

The [001] oriented single crystals of nickel-base superalloy NASAIR 100 with the planar, cellular, coarse-dendritic, and fine-dendritic solid/liquid (S/L) interfaces were prepared, respectively, and their microstructure and stress-rupture behavior at 1050 degrees C were investigated in both as-cast and solution heat-treated conditions. It was found that in as-cast single crystals of NASAIR 100, microsegregation and gamma/gamma' eutectic produced in the solidification process increased, gamma' size decreased, and gamma' shape tended progressively to be cuboidal, with the successive transition of the S/L interface from planar to cellular, then to coarse-dendritic, and finally to fine-dendritic morphology. Furthermore, the solution temperature required to dissolve all as-cast gamma' and most of the gamma/gamma' eutectic increased with the aforementioned successive transition of S/L interfaces. The reprecipitated gamma', after solution heat treatment (SHT), was usually fine and cuboidal. However, some W-rich phase was present in the heat-treated dendritic single crystals. Both the planar and the cellular single crystals of NASAIR 100 exhibited no superiority in stress-rupture life, irrespective of the heat-treatment conditions. Instead, the single crystals with dendritic morphology possessed excellent stress-rupture lives, after heat treatment at 1320 degrees C for 4 hours, followed by air cooling (AC). Perfect gamma' rafts with high-average aspect ratios formed during the stress-rupture tests of dendritic single crystals; in contrast, irregularly coarsening structures appeared in both the planar and cellular single crystals. The microstructure and solution behavior were illustrated in detail. Furthermore, the microstructural factors to affect the high-temperature stress-rupture life of the single crystals of NASAIR 100 were also analyzed.