High-Thermal-Conductivity AlN Filler for Polymer/Ceramics Composites

被引：105

作者：

Kume, Shoichi ^{[1
]}

Yamada, Ikuko ^{[1
]}

Watari, Koji ^{[1
]}

Harada, Isao ^{[2
]}

Mitsuishi, Kenshi ^{[2
]}

机构：

[1] Natl Inst Adv Ind Sci & Technol, Moriyama Ku, Nagoya, Aichi 4638560, Japan

[2] Mitsui Chem Inc, Shiodome City Ctr, Minato Ku, Tokyo 1057117, Japan

来源：

JOURNAL OF THE AMERICAN CERAMIC SOCIETY | 2009年 / 92卷 / 01期

关键词：

ALUMINUM NITRIDE; HEAT-CAPACITY; BORON-NITRIDE; MATRIX;

D O I：

10.1111/j.1551-2916.2008.02650.x

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

To increase the thermal conductivity of polymer/ceramic composites, aluminum nitride (AlN) granules were added as a ceramic filler. Granules, sintered at 1850 degrees C for 24 h, showed a very high conductivity of 266 +/- 26 W (m.degrees C)(-1), as measured by a thermal microscope equipped with thermoreflectant and periodic heating techniques. This conductivity exceeds 80% of the theoretical value of AlN. Ceramic fillers consisting of the obtained AlN granules and commercially available hexagonal boron nitride particles (h-BN) powder plus polyimide resins were mixed and then molded at 100 MPa and 420 degrees C in a vacuum. The resultant composite showed a high conductivity of 9.3 W (m.degrees C)(-1). This study demonstrates that a high-thermal-conductivity filler effectively enhances the conductivity of polymer/ceramic composites.

引用

页码：S153 / S156

页数：4

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