AES studies of interdiffusion in thin-film copper-palladium multilayer structures

被引：11
作者：
Bukaluk, A [1 ]
机构：
[1] Akad Tech Rolnicza, Inst Matemat & Fiz, PL-85796 Bydgoszcz, Poland
来源：
VACUUM | 1999年 / 54卷 / 1-4期
关键词：
Auger electron spectroscopy; depth profiles; diffusion;
D O I：
10.1016/S0042-207X(98)00478-3
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The process of interdiffusion in thin film Cu-Pd multilayer system was studied in the temperature range of 393-493 K for different annealing times using Auger electron spectroscopy (AES) in conjunction with an argon ion sputtering. The changes in Auger depth profiles caused by heating have been converted into compositional changes of diffusing species. On the basis of the concentration distribution of Pd and Cu inside the Pd-Cu multilayer structure the interdiffusion coefficients have been obtained in the studied temperature range. Interdiffusion data have been discussed and compared with diffusion parameters obtained by using different methods. (C) 1999 Elsevier Science Ltd. All rights reserved.
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页码：279 / 283
页数：5
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