A novel fast and low cost replication technology for high-aspect-ratio magnetic microstructures

被引:3
作者
Dai, Xuhan [1 ,2 ]
Miao, Xiaodan [1 ]
Shao, Guocheng [2 ]
Wang, Wanjun [2 ]
机构
[1] Shanghai Jiao Tong Univ, Natl Key Lab Sci & Technol Nano Micro Fabricat Te, Res Inst Micro Nano Sci & Technol, Shanghai 200240, Peoples R China
[2] Louisiana State Univ, Dept Mech Engn, Baton Rouge, LA 70803 USA
来源
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2013年 / 19卷 / 03期
关键词
FABRICATION; SYSTEMS; MEMS;
D O I
10.1007/s00542-012-1640-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes a new fabrication technology for high aspect ratio magnetic microstructures. These microstructures are made of composite magnetic materials. In this new technology, a master mold was made using photolithography and the mixture of magnetic particles and polymer was used in micro-molding process. The microstructures were then thermally cured at a temperature lower than 80 A degrees C. To demonstrate the feasibility of using the technology in making magnetic microstructures, both hard magnetic and soft magnetic particles were tried in our experiments. The magnetic particle sizes ranged from 2.3 to 44 mu m, which sets the limitations in feature sizes achievable for the magnetic microstructures. Different weight ratios were tried, the maximum weight ratio between the magnetic particle and the polymer was over 2:1. For both wall and trench microstructures, the maximum aspect ratio was found to be over 10, which demonstrates its great potential for micro-fabrication applications.
引用
收藏
页码:403 / 407
页数:5
相关论文
共 50 条
[41]   Stability of High-Aspect-Ratio Micropillar Arrays against Adhesive and Capillary Forces [J].
Chandra, Dinesh ;
Yang, Shu .
ACCOUNTS OF CHEMICAL RESEARCH, 2010, 43 (08) :1080-1091
[42]   Inkjet Printing of High Aspect Ratio Superparamagnetic SU-8 Microstructures with Preferential Magnetic Directions [J].
Jacot-Descombes, Loic ;
Gullo, Maurizio R. ;
Cadarso, Victor J. ;
Mastrangeli, Massimo ;
Ergeneman, Olgac ;
Peters, Christian ;
Fatio, Philipe ;
Freidy, Mouhamad A. ;
Hierold, Christofer ;
Nelson, Bradley J. ;
Brugger, Juergen .
MICROMACHINES, 2014, 5 (03) :583-593
[43]   Fabrication of a Polymer High-Aspect-Ratio Pillar Array Using UV Imprinting [J].
Shinohara, Hidetoshi ;
Goto, Hiroshi ;
Kasahara, Takashi ;
Mizuno, Jun .
MICROMACHINES, 2013, 4 (02) :157-167
[44]   Facile Nanoimprinting of Robust High-Aspect-Ratio Nanostructures for Human Cell Biomechanics [J].
Shafagh, Reza Zandi ;
Shen, Joanne X. ;
Youhanna, Sonia ;
Guo, Weijin ;
Lauschke, Volker M. ;
van der Wijngaart, Wouter ;
Haraldsson, Tommy .
ACS APPLIED BIO MATERIALS, 2020, 3 (12) :8757-8767
[45]   Plasma chemical etching of high-aspect-ratio silicon micro- and nanostructures [J].
Amirov, I. I. .
RUSSIAN JOURNAL OF GENERAL CHEMISTRY, 2015, 85 (05) :1252-1259
[46]   Research of Micro-inertial device High-Aspect-Ratio Etching parameters [J].
Shi Guixiong ;
Jia Shixing ;
Jiang Guoqin ;
Zhu Jian .
MICRO-NANO TECHNOLOGY XV, 2014, 609-610 :706-709
[47]   Fabrication and Characterization of AFM Probe Integrated with High-Aspect-Ratio Diamond Tip [J].
Shibata, Takayuki ;
Maruno, Kazuhiro ;
Nagai, Moeto ;
Kawashima, Takahiro ;
Mineta, Takashi ;
Makino, Eiji .
EMERGING TECHNOLOGY IN PRECISION ENGINEERING XIV, 2012, 523-524 :569-+
[48]   High-aspect-ratio cylindrical nanopore arrays and their use for templating titania nanoposts [J].
Park, Oun-Ho ;
Cheng, Joy Y. ;
Hart, Mark W. ;
Topuria, Teya ;
Rice, Philip M. ;
Krupp, Leslie E. ;
Miller, Robert D. ;
Ito, Hiroshi ;
Kim, Ho-Cheol .
ADVANCED MATERIALS, 2008, 20 (04) :738-+
[49]   Electrofusion Device With High-Aspect-Ratio Electrodes for the Controlled Fusion of Lipid Vesicles [J].
Okita, Tsutomu ;
Tsugane, Mamiko ;
Kato, Kosuke ;
Shinohara, Keisuke ;
Suzuki, Hiroaki .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2025, 34 (02) :174-183
[50]   High-aspect-ratio aluminum-doped zinc oxide nanomechanical resonator [J].
Nguyen Van Toan ;
Inomata, Naoki ;
Ono, Takahito .
IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING, 2017, 12 :S141-S142