Radiation damage reduction by grain-boundary biased defect migration in nanocrystalline Cu

被引:56
作者
Jin, Miaomiao [1 ]
Cao, Penghui [1 ]
Yip, Sidney [1 ,2 ]
Short, Michael P. [1 ]
机构
[1] MIT, Dept Nucl Sci & Engn, 77 Massachusetts Ave, Cambridge, MA 02139 USA
[2] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA
基金
美国国家科学基金会;
关键词
Nanocrystalline metal; Grain boundary; Damage reduction mechanisms; Self-healing; Stacking fault tetrahedron; IRRADIATION-INDUCED DEFECTS; STACKING-FAULT TETRAHEDRA; IN-SITU; FCC; NI; SIMULATIONS; DISPERSION; EVOLUTION; DIFFUSION; CASCADES;
D O I
10.1016/j.actamat.2018.05.071
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Nanocrystalline materials with a high density of grain boundaries have long been reported to alleviate radiation damage. However, a full mechanistic understanding of defect reduction, particularly the interaction mechanisms between grain boundaries and clustered defects during irradiation, remains an open question. Here we present atomistic simulations of prolonged radiation damage evolution in Cu bicrystals with increasing radiation dose. Our results reveal the atomic details of defect nucleation and migration, and the mechanisms for the annihilation of defect clusters during irradiation. Stacking fault tetrahedra formed due to radiation damage cascades show preferential migration to irradiated grain boundary. Interstitial-loaded grain boundaries are observed to be dynamically resilient, and persistently interact with the stacking fault tetrahedra, revealing a self-healing response to radiation damage. The results show a synergistic effect of grain boundaries on defect annihilation at small grain spacings of less than 6 nm, giving rise to a drastic decrease in the density of defect clusters. These findings, along with the mechanistic insights, present an integrated perspective on interface-mediated damage reduction in radiation-resistant nanomaterials. (C) 2018 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:410 / 417
页数:8
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