Design methodologies of LTCC bandpass filters, diplexer, and triplexer with transmission zeros

被引:81
作者
Tang, CW [1 ]
You, SF
机构
[1] Natl Chung Cheng Univ, Dept Elect Engn, Chiayi 621, Taiwan
[2] Natl Chung Cheng Univ, Dept Commun Engn, Ctr Telecommun Res, Chiayi 621, Taiwan
[3] Natl Chung Cheng Univ, Dept Elect Engn, Chiayi 621, Taiwan
关键词
bandpass filter; diplexer; low-temperature cofired ceramic (LTCC);
D O I
10.1109/TMTT.2005.862638
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new method for designing the multilayered filter, diplexer, and triplexer is proposed in this paper. The main structure of the multilayered filter is a parallel-coupled line connected with a capacitor. By properly controlling the coupling coefficient between the parallel-coupled line and the capacitor, the transmission zero will appear at the lower or higher passband's skirt. Moreover, such characteristics can be employed to design the diplexer as well for dual- or quad-band portable telephones. In order to miniaturize the size of the circuit and to improve its performance, multilayered structure and the low-temperature co-fired ceramic technology are employed to design and fabricate the filter. Theoretical analysis and design procedures are also provided. Measurement results of fabricated examples are shown to match well with the electromagnetic simulation, which validate the proposed structure.
引用
收藏
页码:717 / 723
页数:7
相关论文
共 20 条
[1]  
Chang CH, 2003, IEEE MTT-S, P511, DOI 10.1109/MWSYM.2003.1210988
[2]   THE MINIATURIZATION TECHNOLOGIES - PAST, PRESENT, AND FUTURE [J].
FRAZIER, AB ;
WARRINGTON, RO ;
FRIEDRICH, C .
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 1995, 42 (05) :423-430
[3]   A 1.9-GHz DECT CMOS power amplifier with fully integrated multilayer LTCC passives [J].
Heo, D ;
Sutono, A ;
Chen, E ;
Suh, Y ;
Laskar, J .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2001, 11 (06) :249-251
[4]  
Hong J.S., 2001, MICROSTRIP FILTERS
[5]   A diplexer-matching dual-band power amplifier LTCC module for IEEE 802.11 a/b/g wireless LANs [J].
Kunihiro, K ;
Yamanouchi, S ;
Miyazaki, T ;
Aoki, Y ;
Ikuina, K ;
Ohtsuka, T ;
Hida, H .
2004 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2004, :303-306
[6]  
Leung WY, 2001, APMC 2001: ASIA-PACIFIC MICROWAVE CONFERENCE, VOLS 1-3, PROCEEDINGS, P1008, DOI 10.1109/APMC.2001.985288
[7]   The impact of miniaturization and passive component integration in emerging MCM applications [J].
Low, YL ;
Frye, RC .
1997 IEEE MULTI-CHIP MODULE CONFERENCE - PROCEEDINGS, 1997, :27-32
[8]   RF-SoC - Expectations and required conditions [J].
Matsuzawa, A .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2002, 50 (01) :245-253
[9]  
MATTHEL GL, 1980, MICROWAVE FILTERS IM
[10]  
Miyake H, 1997, IEEE MTT-S, P789, DOI 10.1109/MWSYM.1997.602908