A Numerical Model of Thermoelastic Damping in Prestressed Micromechanical Resonators

被引：0

作者：

Meng, Peng ^{[1
]}

Gu, Wenting ^{[1
]}

Hao, Zhili ^{[1
]}

机构：

[1] Old Dominion Univ, Dept Mech & Aerosp Engn, Norfolk, VA 23529 USA

来源：

PROCEEDINGS OF THE 4TH INTERNATIONAL CONFERENCE ON MECHANICAL ENGINEERING AND MECHANICS | 2011年

关键词：

MEMS; resonators; Vibrations; Thermoelastic damping; Quality factor; Frequency response;

D O I：

暂无

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This paper presents a numerical model of thermoelastic damping (TED) in prestressed micromechanical resonators. The numerical model of TED consists of three sequential simulations: static simulation for prestressing a resonator, elastic vibration simulation for obtaining the related vibration parameters of the resonant mode of interest, and transient heat conduction for calculating TED occurring during one vibration time period. This model is implemented in the MEMS Module of finite element analysis software, COMSOL. It is verified with flexural-mode beam resonators. The simulation results suggest that TED does not vary much with low prestress level, but increases significantly at a high prestress level for micromechanical resonators operating in flexural-mode.

引用

页码：710 / 713

页数：4

共 14 条

[1] Engineering MEMS resonators with low thermoelastic damping [J].

Duwel, Amy ;

Candler, Rob N. ;

Kenny, Thomas W. ;

Varghese, Mathew .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2006, 15 (06) :1437-1445

[2] A thermal-energy method for calculating thermoelastic damping in micromechanical resonators [J].

Hao, Zhili ;

Xu, Yang ;

Durgam, Shiva Krishna .

JOURNAL OF SOUND AND VIBRATION, 2009, 322 (4-5) :870-882

[3] An analytical model for support loss in micromachined beam resonators with in-plane flexural vibrations [J].

Hao, ZL ;

Erbil, A ;

Ayazi, F .

SENSORS AND ACTUATORS A-PHYSICAL, 2003, 109 (1-2) :156-164

[4] Thermoelastic damping effect on in-extensional vibration of rotating thin ring [J].

Kim, Sun-Bae ;

Na, Young-Ho ;

Kim, Ji-Hwan .

JOURNAL OF SOUND AND VIBRATION, 2010, 329 (09) :1227-1234

[5] Stress-dependent thermal relaxation effects in micro-mechanical resonators [J].

Kumar, Sandeep ;

Haque, M. Aman .

ACTA MECHANICA, 2010, 212 (1-2) :83-91

[6] Thermoelastic damping in micro- and nanomechanical systems [J].

Lifshitz, R ;

Roukes, ML .

PHYSICAL REVIEW B, 2000, 61 (08) :5600-5609

[7] A 12 MHz micromechanical bulk acoustic mode oscillator [J].

Mattila, T ;

Kiihamäki, J ;

Lamminmäki, T ;

Jaakkola, O ;

Rantakari, P ;

Oja, A ;

Seppä, H ;

Kattelus, H ;

Tittonen, I .

SENSORS AND ACTUATORS A-PHYSICAL, 2002, 101 (1-2) :1-9

[8] An integrated CMOS micromechanical resonator high-Q oscillator [J].

Nguyen, CTC ;

Howe, RT .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1999, 34 (04) :440-455

[9] Theory of thermoelastic damping in micromechanical resonators with two-dimensional heat conduction [J].

Prabhakar, Sairam ;

Vengallatore, Srikar .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2008, 17 (02) :494-502

[10] Thermoelastic damping in bilayered micromechanical beam resonators [J].

Prabhakar, Sairam ;

Vengallatore, Srikar .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2007, 17 (03) :532-538

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