Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

被引：1

作者：

Lin, Chen-Yi ^{[1
]}

Chiu, Tsung-Chieh ^{[1
]}

Lin, Kwang-Lung ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, 1 Univ Rd, Tainan 70101, Taiwan

来源：

JOURNAL OF APPLIED PHYSICS | 2018年 / 123卷 / 11期

关键词：

ELECTROMIGRATION; DISSOLUTION; TECHNOLOGY; MECHANISM; ALLOYS; NI;

D O I：

10.1063/1.5011667

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

An electric current can asymmetrically trigger either atomic migration or interfacial reactions between a cathode and an anode. The present study investigated the dissolution of metallization and formation of an interfacial intermetallic compound (IMC) in the Cu/Ni/Sn1.0Ag0.1Cu0.02Ni0.05In/Ni/Cu solder joint at various current densities in the order of 10(3) A/cm(2) at temperatures ranging from 100 degrees C to 150 degrees C. The polarization behavior of Ni dissolution and IMC formation under current stressing were systematically investigated. The asymmetrical interfacial reactions of the solder joint were found to be greatly influenced by ambient temperature. The dissolution of Ni and its effect on interfacial IMC formation were also discussed. Published by AIP Publishing.

引用

页数：6

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