A model of the underfill flow process: Particle distribution effects

被引：36

作者：

Guo, Y ^{[1
]}

Lehmann, GL ^{[1
]}

Driscoll, T ^{[1
]}

Cotts, EJ ^{[1
]}

机构：

[1] SUNY Binghamton, Binghamton, NY 13902 USA

来源：

49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS | 1999年

关键词：

D O I：

10.1109/ECTC.1999.776066

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Key features of the underfill flow process are simulated by investigating the capillary flow of a dense suspension into a plane channel. A flow model is posed which includes submodels for wetting and rheology. The infiltration rate is successfully predicted if the velocity and particle concentration fields are modeled by coupled transport equations.

引用

页码：71 / 76

页数：6