Crack initiation in machining monocrystalline silicon

Based on the discussion in which the defect as a source of cracks must be created during cutting a silicon monocrystal, the renormalization group molecular dynamics has been proposed to simulate the defect initiation process. The method can be applied to a model of micrometer size, which is necessary to bring about brittle mode cutting, and yet permit the observations of the defect initiation process of an atomic size. The result of the simulation shows that a microcrack-like defect can be initiated during cutting through the interaction between a local static stress distribution and global dynamic stress associated with acoustic waves.