Study on Improved Grinding Process of Sapphire with LED Substrate Material in Manufacturing Engineering

被引：4

作者：

Zhou, Hai ^{[1
]}

Xu, Xiaoming ^{[1
]}

Zhuo, Zhiguo ^{[1
]}

Zang, Yue ^{[1
]}

Xu, Louxi ^{[1
]}

Feng, Huan ^{[1
]}

机构：

[1] Yancheng Inst Technol, Yancheng 224051, Peoples R China

来源：

ADVANCED COMPOSITE MATERIALS AND MANUFACTURING ENGINEERING | 2012年 / 583卷

关键词：

Sapphire; Robber pad grinding; TTV; BOW; SILICON-WAFERS;

D O I：

10.4028/www.scientific.net/AMR.583.314

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Method for grinding by adding rubber pad between LED sapphire substrate and ceramic supporting is proposed though the ANSYS finite element analysis, which obtains high flatness of the surface of a substrate efficiently. The experimental results also confirmed that after grinding the 2-inch sapphire substrate in the cushion, the total thickness of the error (TTV) <4 microns and the BOW <3 microns. Therefore, the upholstered film is one of the efficient, economic and highly automated ways to grind sapphire substrate.

引用

页码：314 / 317

页数：4

共 5 条

[1]

KATO T, 1997, Patent No. 0798405A2

[2]

Meng Jianfeng, 2006, DIAMOND WIRE PROCESS

[3] Grinding of silicon wafers: A review from historical perspectives [J].

Pei, Z. J. ;

Fisher, Graham R. ;

Liu, J. .

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2008, 48 (12-13) :1297-1307

[4] A grinding-based manufacturing method for silicon wafers: an experimental investigation [J].

Pei, ZJ ;

Fisher, GR ;

Bhagavat, M ;

Kassir, S .

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2005, 45 (10) :1140-1151

[5]

Yasunaga N., 1997, ADV ABR TECHN P INT, V7, P96

← 1 →