Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles

被引：22
作者：
Lin, Yung-Sen [1 ]
Chiu, Sheng-Shiang [1 ]
机构：
[1] Feng Chia Univ, Dept Chem Engn, Taichung 407, Taiwan
来源：
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | 2008年 / 22卷 / 14期
关键词：
Copper particles; oxidation; particle shape; silver coating; Auger electron spectroscopy; electrical conduction; conductive adhesive;
D O I：
10.1163/156856108X320537
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
This study focuses on the effects of particle composition, particle shape, particle size and oxidizing temperature on the electrical properties of copper-filled electrically- conductive adhesives (CFECAs) and the pressure-dependent conduction behavior of compressed copper particles (CCPs). Silver-coated copper particles and un-coated copper particles of both spherical and flake-shaped types were oxidized at 30 degrees C, 175 degrees C and 240 degrees C for two hours. The copper particles were dispersed in an epoxy matrix for CFECAs or compressed in a mold for CCPs. Silver-coated copper particles showed significantly greater oxidation resistance than un-coated copper particles since the silver coating provides good oxidation resistance at temperatures lower than 175 degrees C. Thermogravimetric Analysis (TGA), X-ray diffraction (XRD) and Auger Electron Spectroscopy were used to observe how metal oxides such as AgO and Cu2O affected the electrical properties of CFECAs and the conduction behavior of CCPs. The electrically-conductive adhesives (ECAs) filled with flake-shaped copper particles offer better electrical conduction than the ECAs filled with spherical copper particles. (c) Koninklijke Brill NV, Leiden, 2008
引用
收藏
页码：1673 / 1697
页数：25
相关论文
共 51 条
[21]   Development of conductive adhesive materials for via fill applications [J].
Kang, SK ;
Buchwalter, S ;
LaBianca, N ;
Gelorme, J ;
Purushothaman, S ;
Papathomas, K ;
Poliks, M .
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, :887-891
[22]   Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives [J].
Klosterman, D ;
Li, L ;
Morris, JE .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (01) :23-31
[23]   MULTICOMPONENT POLYMERIC COMPOSITES [J].
KUZEL, R ;
KRIVKA, I ;
KUBAT, J ;
PROKES, J ;
NESPUREK, S ;
KLASON, C .
SYNTHETIC METALS, 1994, 67 (1-3) :255-261
[24]   Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering [J].
Li, Y ;
Moon, KS ;
Wong, CP .
JOURNAL OF APPLIED POLYMER SCIENCE, 2006, 99 (04) :1665-1673
[25]   Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications [J].
Li, Y ;
Wong, CP .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2006, 51 (1-3) :1-35
[26]   Minimax regret analysis for municipal solid waste management: An interval-stochastic programming approach [J].
Li, Yong P. ;
Huang, Guo H. .
JOURNAL OF THE AIR & WASTE MANAGEMENT ASSOCIATION, 2006, 56 (07) :931-944
[27]   Effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives for microelectronic applications [J].
Lin, YS ;
Chiu, SS .
POLYMER ENGINEERING AND SCIENCE, 2004, 44 (11) :2075-2082
[28]   Electrical properties of conductive adhesives as affected by particle compositions, particle shapes, and oxidizing temperatures of copper powders in a polymer matrix [J].
Lin, YS ;
Chiu, SS .
JOURNAL OF APPLIED POLYMER SCIENCE, 2004, 93 (05) :2045-2053
[29]   Effects of mixing procedures on the volume fraction of silver particles in conductive adhesives [J].
Lo, CT ;
Chou, KS ;
Chin, WK .
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2001, 15 (07) :783-792
[30]   DEVELOPMENT OF ELECTRICAL-CONDUCTION IN SILVER-FILLED EPOXY ADHESIVES [J].
LOVINGER, AJ .
JOURNAL OF ADHESION, 1979, 10 (01) :1-15
123456