3-Dimensional Numerical Simulation of Open-Barrel Crimping Process

被引：15

作者：

Zhmurkin, Dmitry V. ^{[1
]}

Corman, Ned E. ^{[1
]}

Copper, Charles D. ^{[1
]}

Hilly, Robert D. ^{[1
]}

机构：

[1] Tyco Elect, Harrisburg, PA 17105 USA

来源：

ELECTRICAL CONTACTS 2008: PROCEEDINGS OF THE FIFTY-FOURTH IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS | 2008年

关键词：

Finite elements methods; numerical analysis; connectors; crimp;

D O I：

10.1109/HOLM.2008.ECP.41

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A study of an open-barrel crimping process of 7-stranded wire has been conducted using a full 3-dimensional non-linear explicit dynamic finite element model. 3D dynamic simulation of the crimping process allowed capturing parameters not available in commonly used 2D models, such as barrel and wire extrusion, effect of serrations, and effect of crimper geometry. The model was validated using experimental results. Numerical results indicate that elastic springback of the crimp, upon release of the tool pressure after crimping, is an essential design parameter engineered into a reliable crimped termination. The springback behavior was confirmed experimentally using metallurgical cross sections of terminals treated to reduce adhesion between the wire and the terminal.

引用

页码：178 / 184

页数：7

共 12 条

[1] Abbas M, 2003, RECENT ADVANCES IN INTEGRATED DESIGN AND MANUFACTURING IN MECHANICAL ENGINEERING, P241
[2] BOWDEN FP, 2000, OXFORD CLASSIC TEXTS, P119
[3] Comparison of the implicit and explicit finite element methods using crystal plasticity
Harewood, F. J.
McHugh, P. E.
[J]. COMPUTATIONAL MATERIALS SCIENCE, 2007, 39 (02) : 481 - 494
[4] HAUSWALD T, 2008, COMMUNICATION APR
[5] KUGENER S, 1995, AMP J TECH, V4
[6] MORITA T, 1996, P 42 IEEE HOLM C EL, P151
[7] MROCZKOWSKI RS, 1995, P 41 IEEE HOLM C EL, P154
[8] MROCZKOWSKI RS, 1996, P 29 ANN CONN INT S, P439
[9] Mechanical analysis of the crimping connection
Ogihara, Shigeru
Takata, Kensaku
Hattori, Yasuhiro
Yoshida, Kazuhiro
[J]. PROCEEDINGS OF THE FIFTY-SECOND IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS, 2006, : 89 - +
[10] Pauskar PM, 2004, AIP CONF PROC, V712, P412, DOI 10.1063/1.1766559

← 1 2 →