Role of bias conditions in the hot carrier degradation of AlGaN/GaN high electron mobility transistors

被引:10
作者
Mukherjee, Shubhajit [1 ]
Puzyrev, Yevgeny [1 ]
Hinckley, John [1 ]
Schrimpf, Ronald D. [1 ]
Fleetwood, Daniel M. [1 ]
Singh, Jasprit [1 ]
Pantelides, Sokrates T. [1 ]
机构
[1] Vanderbilt Univ, Interdisciplinary Program Mat Sci, Nashville, TN 37212 USA
来源
PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 10, NO 5 | 2013年 / 10卷 / 05期
关键词
HEMT; AlGaN/GaN; hot carrier effects; Monte-Carlo analysis; RELIABILITY;
D O I
10.1002/pssc.201200620
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The impacts of gate bias and device temperature on carrier energy distributions are reported for AlGaN/GaN High Electron Mobility Transistors. The lateral electric field and the average carrier energy are the highest at the end of gate on the gate-drain access side. The number of high energy carriers is the greatest in the semi-ON operating condition, with maximum energies exceeding the activation energy of defects in the AlGaN. There is a significant decrease in the number of very high energy carriers (greater than 2 eV) as the device temperature increases whereas the number of moderately energetic carriers (between 1 to 2 eV) is higher at elevated temperatures. [GRAPHICS] (C) 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
引用
收藏
页码:794 / 798
页数:5
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