Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages

被引:107
作者
Zhang, Yaojiang [1 ]
Fan, Jun [1 ]
Selli, Giuseppe [2 ]
Cocchini, Matteo [1 ]
de Paulis, Francesco [1 ]
机构
[1] Missouri Univ Sci & Technol, Electromagnet Compatibil Lab, Dept Elect & Comp Engn, Rolla, MO 65409 USA
[2] Amkor Technol, Chandler, AZ 85286 USA
关键词
analytical formula; Green's function in a coaxial cavity; multilayer package/printed circuit board (PCB); signal integrity; via-holes; via-plate capacitance;
D O I
10.1109/TMTT.2008.2002237
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated analytically in terms of higher order parallel-plate modes. The Green's function in a bounded coaxial cavity for a concentric magnetic ring current is first derived by introducing reflection coefficients for cylindrical waves at the inner and outer cavity walls. These walls can be perfect electric conductor (PEC)/perfect magnetic conductor (PMC) or a nonreflective perfectly matched layer. By further assuming a magnetic frill current on the via-hole in the metal plate, an analytical formula is derived for the via barrel-plate capacitance by summing the higher order modes in the bounded coaxial cavity. The convergence of the formula with the number of modes, as well as with the radius of the outer PEC/PMC wall is discussed. The analytical formula is validated by both quasi-static numerical methods and measurements. Furthermore, the formula allows the investigation of the frequency dependence of the via-plate capacitance, which is not possible with quasi-static methods.
引用
收藏
页码:2118 / 2128
页数:11
相关论文
共 30 条
  • [11] Modeling complex via hole structures
    Laermans, E
    De Geest, J
    De Zutter, D
    Olyslager, F
    Sercu, S
    Morlion, D
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (02): : 206 - 214
  • [12] WAVE MODEL SOLUTION TO THE GROUND POWER PLANE NOISE PROBLEM
    LEI, GT
    TECHENTIN, RW
    HAYES, PR
    SCHWAB, DJ
    GILBERT, BK
    [J]. IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 1995, 44 (02) : 300 - 303
  • [13] THEORY AND EXPERIMENT ON MICROSTRIP ANTENNAS
    LO, YT
    SOLOMON, D
    RICHARDS, WF
    [J]. IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 1979, 27 (02) : 137 - 145
  • [14] FULL-WAVE ANALYSIS OF PROPAGATION CHARACTERISTICS OF A THROUGH HOLE USING THE FINITE-DIFFERENCE TIME-DOMAIN METHOD
    MAEDA, S
    KASHIWA, T
    FUKAI, I
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1991, 39 (12) : 2154 - 2159
  • [15] MARCUVITZ N, 1951, RAD LAB, P74
  • [16] Rigorous and simplified models for the capacitance of a circularly symmetric via
    Mathis, AW
    Peterson, AF
    Butler, CM
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1997, 45 (10) : 1875 - 1878
  • [17] Computation of the equivalent capacitance of a via in a multilayered board using the closed-form Green's function
    Oh, KS
    SchuttAine, JE
    Mittra, R
    Wang, B
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1996, 44 (02) : 347 - 349
  • [18] Application of the Foldy-Lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards
    Ong, C. -J.
    Miller, D.
    Tsang, L.
    Wu, B.
    Huang, C. -C.
    [J]. MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2007, 49 (01) : 225 - 231
  • [19] Analysis of via capacitance in arbitrary multilayer PCBs
    Pajovic, Miroslav
    Yu, Jinghan
    Milojkovic, Dragan
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2007, 49 (03) : 722 - 726
  • [20] Stable methods for recognizing acronym-expansion pairs: from rule sets to hidden Markov models
    Schumann, Eduardo Torres
    Schulz, Klaus U.
    [J]. INTERNATIONAL JOURNAL ON DOCUMENT ANALYSIS AND RECOGNITION, 2006, 8 (01) : 1 - 14