SU-8-carbon composite as conductive photoresist for biochip applications

被引:26
作者
Benlarbi, Mouhssine [1 ]
Blum, Loic J. [1 ]
Marquette, Christophe A. [1 ]
机构
[1] Univ Lyon 1, Lab Genie Enzymat Membranes Biomimet & Assemblage, Inst Chim & Biochim Mol & Supramol, CNRS ICBMS 5246, F-69622 Villeurbanne, France
关键词
Biochip; Composite photoresist; Electrografting; Photopatterning; ELECTROCHEMICAL REDUCTION; COVALENT IMMOBILIZATION; ELECTRODE; SU-8; GOLD; DNA;
D O I
10.1016/j.bios.2012.05.026
中图分类号
Q6 [生物物理学];
学科分类号
071011 ;
摘要
A composite photoresist has been developed for the direct photopatterning of electrodes useful as biochip substrates. The material is composed of SU-8 polymer added with graphite carbon filler which enables patterning of conductive thin films (22 mu m) on both glass substrate and transparency flexible film with a standard UV photolithography protocol. The resolution obtained using the conductive composite compared well with the bare resist, with lateral resolutions of 5 and 10 mu m for bare and conductive resists, respectively. The obtained electrodes, after an electrochemical pre-treatment, exhibited very good electrochemical behaviors, opening the path to various electrochemical detections and grafting possibilities. In order to demonstrate the potentialities of the developed material in the biosensors and biochips field, DNA probes were electrografted, using diazonium chemistry, directly at the composite photoresist surface. Target oligonucleotide interactions were detected using chemiluminescent labeling and a satisfactory detection limit of 0.25 nM target sequence was demonstrated with a detection ranging over three orders of magnitude. (C) 2012 Elsevier BM. All rights reserved.
引用
收藏
页码:220 / 225
页数:6
相关论文
共 22 条
  • [1] Percolation and tunneling in composite materials
    Balberg, I
    Azulay, D
    Toker, D
    Millo, O
    [J]. INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2004, 18 (15): : 2091 - 2121
  • [2] Barber RL, 2005, MICROSYST TECHNOL, V11, P303, DOI 10.1007/S00542-004-0442-Z
  • [3] Semiconducting properties of thin films with embedded nanoparticles
    Benlarbi, Mouhssine
    Farre, Carole
    Chaix, Carole
    Lawrence, Marcus F.
    Blum, Loic J.
    Lysenko, Volodymyr
    Marquette, Christophe A.
    [J]. SYNTHETIC METALS, 2010, 160 (23-24) : 2675 - 2680
  • [4] A versatile method for direct and covalent immobilization of DNA and proteins on biochips
    Corgier, Benjamin P.
    Laurent, Alain
    Perriat, Pascal
    Blum, Loic J.
    Marquette, Christophe A.
    [J]. ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2007, 46 (22) : 4108 - 4110
  • [5] Diazonium-protein adducts for graphite electrode microarrays modification: Direct and addressed electrochemical immobilization
    Corgier, BP
    Marquette, CA
    Blum, LJ
    [J]. JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2005, 127 (51) : 18328 - 18332
  • [6] SU-8 as resist material for deep X-ray lithography
    Cremers, C
    Bouamrane, F
    Singleton, L
    Schenk, R
    [J]. MICROSYSTEM TECHNOLOGIES, 2001, 7 (01) : 11 - 16
  • [7] Composite ferromagnetic photoresist for the fabrication of microelectromechanical systems
    Damean, N
    Parviz, BA
    Lee, JN
    Odom, T
    Whitesides, GM
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2005, 15 (01) : 29 - 34
  • [8] Two steps micromoulding and photopolymer high-aspect ratio structuring for applications in piezoelectric motor components
    Dellmann, L
    Roth, S
    Beuret, C
    Paratte, L
    Racine, GA
    Lorenz, H
    Despont, M
    Renaud, P
    Vettiger, P
    de Rooij, NF
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 1998, 4 (03): : 147 - 150
  • [9] Electrical properties of thin epoxy-based polymer layers filled with n-carbon black particles
    Gunde, Marta Klanjsek
    Hauptman, Nina
    Macek, Marijan
    [J]. MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY XIII, 2008, 6882
  • [10] Conductive SU8 photoresist for microfabrication
    Jiguet, S
    Bertsch, A
    Hofmann, H
    Renaud, P
    [J]. ADVANCED FUNCTIONAL MATERIALS, 2005, 15 (09) : 1511 - 1516