Mechanical properties of a novel multi-scale silver paste for electronics interconnect application

被引:0
|
作者
Sun, Yongqian [1 ]
Lu, Xiuzhen [1 ]
Zhang, Qiaoran [1 ]
Zhang, Xiaoxin [1 ]
Liu, Johan [2 ]
Ye, Lilei [3 ]
机构
[1] Shanghai Univ, SMIT Ctr, Sch Mechatron & Mech Engn, Shanghai, Peoples R China
[2] Chalmers Univ Technol, Dept Microtechnol & Nanosci, Gothenburg, Sweden
[3] SHT Smart High Tech AB, Gothenburg, Sweden
基金
中国国家自然科学基金;
关键词
silver paste; SCA particles; shear strength; JOINTS;
D O I
10.1109/ICEPT47577.2019.245310
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel nano-silver paste with characteristics of sintering at low temperature and operating at high temperature is one of the most promising interconnect materials in the semiconductor industry. This study focuses on the shear strength of sintered multi-scale silver paste synthesized by nano-silver particles, micro-silver particles and submicron silicon carbide particles coated with Ag (SCA). The silver paste was sintered at 250 degrees C without pressure. The shear strength reaches 9.22 MPa, with 64 wt.% nano-silver particles, 16.5 wt.% micro-silver particles and 1.5 wt.% SCA, respectively. With this, it shows great potential for high power electronics interconnect and cooing applications.
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页数:4
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