Epoxy resin containing trifluoromethyl and pendant polyfluorinated phenyl groups: Synthesis and properties

被引:12
|
作者
Shang, Cheng-Yuan [1 ,2 ]
Zhao, Xiao-Juan [1 ]
Yang, Xin [1 ]
Zhang, Ying [1 ,2 ]
Huang, Wei [1 ]
机构
[1] Chinese Acad Sci, Inst Chem, Beijing 100190, Peoples R China
[2] Chinese Acad Sci, Grad Univ, Beijing 100190, Peoples R China
关键词
fluorine-containing epoxy; dielectric constant; hydrophobicity; reactivity; surface properties; SURFACE-TENSION; SUBSTITUTION; THERMOSET; ETHER;
D O I
10.1177/0954008312449844
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
A novel epoxy resin containing trifluoromethyl and pendant polyfluorinted phenyl groups, 1,1-bis[4-(2,3-epoxypropoxy)phenyl]-1-(3,4,5-trifluorophenyl) -2,2,2-trifluoroethane (6FEP) was synthesized and characterized. The reactivtiy of 6FEP with two aromatic diamines, 4,4'-diaminodiphenyl methane (DDM) and 1,4-bis(4-amino-2-trifluoromethylphenoxy) benzene (6FAPB), and the properties of the cured 6FEP were investigated and compared with those of the commonly used epoxy resin diglycidyl ether of bisphenol A (DGEBA). The experimental results indicated that 6FEP showed lower reactivity than DGEBA. The cured 6FEP exhibited good thermal stabilities with decomposition temperature at 5% weight loss of 374-397 degrees C, high glass transition temperature of 159-177 degrees C and good mechanical properties. The cured 6FEP epoxy resin also showed low dielectric constants at 1 MHz in the range of 3.2-3.4 and dielectric dissipation factors (tan delta) in the range of 2.10-2.48 x 10(-3.) Moreover, the cured 6FEP epoxy resins exhibited higher surface hydrophobicity and lower moisture absorption compared with DGEBA. The improved dielectric properties and hydrophobic properties of the cured 6FEP epoxy resin could be attributed to the introduction of trifluoromethyl and pendant polyfluorinated phenyl groups into the molecular structure of the epoxy resin.
引用
收藏
页码:683 / 691
页数:9
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