Advanced Electrically Conductive Adhesives for High Complexity PCB Assembly

被引：4

作者：

Lopes, P. E. ^{[1
]}

Moura, D. ^{[1
]}

Freitas, D. ^{[1
]}

Proenca, M. F. ^{[2
]}

Figueiredo, H. ^{[3
]}

Alves, R. ^{[3
]}

Paiva, M. C. ^{[1
]}

机构：

[1] Univ Minho, Dept Polymer Engn, IPC i3N, Guimaraes, Portugal

[2] Univ Minho, Dept Chem, Braga, Portugal

[3] CM MFT3 Bosch, Braga, Portugal

来源：

PROCEEDINGS OF THE EUROPE/AFRICA CONFERENCE DRESDEN 2017 - POLYMER PROCESSING SOCIETY PPS | 2019年 / 2055卷

关键词：

SILVER NANOPARTICLES; CARBON NANOTUBES; DISPERSION; GRAPHENE;

D O I：

10.1063/1.5084887

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Electronic packaging, or assembly of packed electronic components on printed circuit boards, present challenges that require innovative solder pastes and electrically conductive adhesives to face the increasing complexity of PCB assembly, with denser board occupation and demanding thermal management during assembly. Our aim is to prepare carbon particle based conductive adhesives. The first step to achieve this goal was to prepare composites with epoxy resin and a variety of nano to micron scale carbon particle, produced by mixing on a three roll mill. The percolation threshold for each particle type was determined as well as the conductivity level reached after percolation.

引用

页数：5

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