An Equivalent Circuit Model With Current Return Path Effects for ON-Chip Interconnect up to 80 GHz

被引:11
作者
Zhu, Yukun [1 ]
Kang, Kai [1 ]
Wu, Yunqiu [1 ]
Zhao, Chenxi [1 ]
Ban, Yong-Ling [1 ]
Guo, Jinhong [1 ]
Sun, Ling Ling [2 ]
Yin, Wen-Yan [3 ]
Xue, Quan [4 ,5 ]
机构
[1] Univ Elect Sci & Technol China, Chengdu 611731, Peoples R China
[2] Hangzhou Dianzi Univ, Hangzhou 310018, Zhejiang, Peoples R China
[3] Zhejiang Univ, Hangzhou 310058, Zhejiang, Peoples R China
[4] City Univ Hong Kong, Dept Elect Engn, State Key Lab Millimeter Waves, Hong Kong, Hong Kong, Peoples R China
[5] City Univ Hong Kong, CityU Shenzhen Res Inst, Hong Kong, Hong Kong, Peoples R China
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2015年 / 5卷 / 09期
基金
美国国家科学基金会;
关键词
Compact model; equivalent circuit model; millimeter wave; ON-chip interconnect; wideband; MILLIMETER-WAVE; TRANSMISSION-LINE; SPIRAL INDUCTORS; INDUCTANCE; SILICON; MICROWAVE;
D O I
10.1109/TCPMT.2015.2448572
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A lumped-element model for ON-chip interconnects is proposed in this paper. The effect of current return path of interconnects is analyzed. An efficient analytical parameter extraction method for the model is proposed. The inductor L-g was adopted in the shunt branch of this model to characterize the induced time-varying magnetic field. Thus, the bandwidth of the model is extended over the resonance frequency. A group of interconnects with different structures were fabricated in a 0.18-mu m CMOS process to investigate the effects of current return path. The good agreement of S-parameters between the model and measurements suggests that the proposed model can accurately predict the performance of interconnect in a wide frequency band up to 80 GHz, even over the resonance frequency.
引用
收藏
页码:1320 / 1330
页数:11
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