Miniaturized Defected Ground High Isolation Crossovers

被引：12

作者：

Packiaraj, D. ^{[1
]}

Vinoy, K. J. ^{[2
]}

Nagarajarao, P. ^{[1
]}

Ramesh, M. ^{[1
]}

Kalghatgi, A. T. ^{[1
]}

机构：

[1] Bharat Elect Ltd, Bangalore, Karnataka, India

[2] Indian Inst Sci, Dept Elect Commun Engn, Bangalore 560012, Karnataka, India

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2013年 / 23卷 / 07期

关键词：

Crossover; defected ground; isolation; top layer; via;

D O I：

10.1109/LMWC.2013.2263219

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This letter relates to the design of crossovers for carrying criss crossing signals. Two types of crossovers are proposed in this letter. Both the crossovers are designed using a two layer printed circuit board. An unbroken continuous transmission line is routed in the top layer for carrying signal 1 from one node to another node. Transmission line used for carrying a signal 2 consists of three physically discontinuous, but electrically connected segments. Two end segments of these are located in the top layer while the middle segment is placed in the bottom layer. While Type I crossover offers an isolation of 25 dB, Type II crossover offers isolation better than 35 dB from dc to 10 GHz. These crossovers are compact and measure an actual size of 10 x 10 x 0.78 mm(3).

引用

页码：347 / 349

页数：3

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