Synthesis, characterization and thermal stability of SnAg and SnAgCu nanoparticles

被引:12
作者
Delsante, S. [1 ,2 ,3 ]
Novakovic, R. [3 ]
Borzone, G. [1 ,2 ,3 ]
机构
[1] Genoa Univ, Dept Chem & Ind Chem, Via Dodecaneso 31, I-16146 Genoa, Italy
[2] Genoa Res Unit INSTM, Via Dodecaneso 31, I-16146 Genoa, Italy
[3] Natl Res Council ICMATE CNR, Inst Condensed Matter Chem & Energy Technol, Via Marini 6, I-16149 Genoa, Italy
关键词
SnAg; SnAgCu; Nanoparticles; Melting point depression; Melting enthalpy; Calorimetry; LEAD-FREE SOLDERS; PHASE-DIAGRAM PREDICTION; AG-CU NANOPARTICLES; PB-FREE SOLDER; MELTING-POINT; ALLOY NANOPARTICLES; SMALL PARTICLES; TIN; TEMPERATURE; BEHAVIOR;
D O I
10.1016/j.jallcom.2018.03.020
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The melting temperature and melting enthalpy of SnAg and SnAgCu (SAC) nanocrystals with diameters of approximately 30 nm was determined and, by means of Differential Scanning Calorimetry (DSC) a depression melting temperature of 7-10 degrees C was observed for both systems. The new experimental results were compared to the predicted values as well as available datasets. X-ray diffraction (XRD) analysis was performed to characterize the as-prepared and heat treated samples. Scanning electron microscopy (SEM and FE-SEM) analysis was carried out to study the morphology, microstructure and phase evolution of the as-synthesized particles before and after the heating process. (C) 2018 Elsevier B.V. All rights reserved.
引用
收藏
页码:385 / 393
页数:9
相关论文
共 57 条
  • [31] Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
    Moon, KW
    Boettinger, WJ
    Kattner, UR
    Biancaniello, FS
    Handwerker, CA
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) : 1122 - 1136
  • [32] Pb-free solders: Part 1. Wettability testing of Sn-Ag-Cu alloys with Bi additions
    Moser, Z
    Gasior, W
    Bukat, K
    Pstrus, J
    Kisiel, R
    Sitek, J
    Ishida, K
    Ohnuma, I
    [J]. JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION, 2006, 27 (02) : 133 - 139
  • [33] Recent Advances in the Synthesis and Main Applications of Metallic Nanoalloys
    Munoz-Flores, Blanca M.
    Kharisov, Boris I.
    Jimenez-Perez, Victor M.
    Martinez, Perla Elizondo
    Lopez, Susana T.
    [J]. INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 2011, 50 (13) : 7705 - 7721
  • [34] Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys
    Ohnuma, I
    Miyashita, M
    Anzai, K
    Liu, XJ
    Ohtani, H
    Kainuma, R
    Ishida, K
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) : 1137 - 1144
  • [35] Gram level synthesis of lead-free solder in the nanometer length scale obtained from tin and silver compounds using silicone oil
    Pande, Surojit
    Sarkar, Achintya Kumar
    Basu, Mrinmoyee
    Jana, Subhra
    Sinha, Arun Kumar
    Sarkar, Sougata
    Pradhan, Mukul
    Saha, Sandip
    Pal, Anjah
    Pal, Tarasankar
    [J]. LANGMUIR, 2008, 24 (16) : 8991 - 8997
  • [36] Electrical properties of silver paste prepared from nanoparticles and lead-free frit
    Park, Sung Hyun
    Seo, Dong Seok
    Lee, Jong Kook
    [J]. JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2007, 7 (11) : 3917 - 3919
  • [37] Multiscale approach for studying melting transitions in CuPt nanoparticles
    Pavan, Luca
    Baletto, Francesca
    Novakovic, Rada
    [J]. PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2015, 17 (42) : 28364 - 28371
  • [38] Pawlow P, 1909, Z PHYS CHEM-STOCH VE, V65, P545
  • [39] The local nominal composition-useful concept for microjoining and interconnection applications
    Ronka, KJ
    vanLoo, FJJ
    Kivilahti, JK
    [J]. SCRIPTA MATERIALIA, 1997, 37 (10) : 1575 - 1581
  • [40] Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system
    Roshanghias, Ali
    Vrestal, Jan
    Yakymovych, Andriy
    Richter, Klaus W.
    Ipser, Herbert
    [J]. CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, 2015, 49 : 101 - 109