ULTRASONIC-VIBRATION-ASSISTED GRINDING OF BRITTLE MATERIALS: A MECHANISTIC MODEL FOR CUTTING FORCE

被引：0

作者：

Qin, Na ^{[1
,2
]}

Pei, Z. J. ^{[2
]}

Cong, W. L. ^{[2
]}

Treadwell, C. ^{[3
]}

Guo, D. M. ^{[1
]}

机构：

[1] Dalian Univ Technol, Sch Mech Engn, Dalian, Liaoning, Peoples R China

[2] Kansas State Univ, Dept Ind & Mfg Syst Engn, Manhattan, KS USA

[3] Sonic Mill, Albuquerque, NM 87102 USA

来源：

PROCEEDINGS OF THE ASME INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE 2011, VOL 1 | 2011年

基金：

美国国家科学基金会;

关键词：

Brittle material; Cutting force; Grinding; Machining; Silicon; Ultrasonic vibration; MATERIAL REMOVAL;

D O I：

暂无

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

A mechanistic model for cutting force in ultrasonic-vibration-assisted grinding (UVAG) (also called rotary ultrasonic machining) of brittle materials is proposed for the first time. Fundamental assumptions include: (1) brittle fracture is the dominant mechanism of material removal, and (2) the removed volume by each diamond grain in one vibration cycle can be related to its indentation volume in the workpiece through a mechanistic parameter. Experiments with UVAG of silicon are conducted to determine the mechanistic parameter for silicon. With the developed model, influences of six input variables on cutting force are predicted. These predicted influences trends are also compared with those determined experimentally for several brittle materials.

引用

页码：127 / +

页数：3

共 30 条

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