Plasma enhanced CVD of low dielectric constant plasma polymerized decahydronaphthalene thin films

Properties of low dielectric constant, plasma polymerized decahydronaphthalene (PPDHN) thin films deposited by plasma enhanced (PE) CVD were investigated. Plasma power significantly affected the dielectric constants and thermal stability of the deposited films. As plasma power was increased from 30 W to 90 W, the relative dielectric constant, k, of the deposited PPDHN thin films increased from 2.65 to 3.12. With the increase in plasma power, integrated peak areas of C=O stretching (similar to1700 cm(-1)) and O-H stretching (similar to3400 cm(-1)) vibrations increased, while that of the CH, stretching (similar to2900 cm(-1)) vibration decreased. All the PPDHN films were thermally stable to 350degreesC. Upon annealing at 400degreesC, the film deposited at 30 W showed similar to35 % thickness reduction, while the film deposited at 90 W showed only similar to15 % thickness reduction. All the deposited thin films showed a leakage current density below 10(-8) A cm(-2) at 1 MV cm(-1).