Relationship between crystallographic structure of electroplated Cu-Sn alloy film and its thermal equilibrium diagram

被引:0
作者
Liang, HY [1 ]
Chikazawa, M [1 ]
Watanabe, T [1 ]
机构
[1] Tokyo Metropolitan Univ, Grad Sch Engn, Dept Appl Chem, Hachioji, Tokyo 1920397, Japan
关键词
copper tin; phase diagram; thermal wquilibrium diagram; intermetallic compound; amorphous; metastable phase; structure; transmission electron microscope; TEM electroplating; alloy;
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
The crystallographic structure of an electroplated Cu-Sn alloy film was investigated in detail using an X-ray diffraction method and electron microscopy. This structure was then compared with the thermal equilibrium diagram of Cu-Sn alloy. The structure of the plated film does not always agree with its thermal equilibrium diagram but is cross related. In this alloy system some metastable phases have been discovered. In this investigation further four kinds of metastable phases were discovered. They are two kinds of tetragonal system crystals, one kind of orthorombic crystal, and one super-saturated solid solution. The lattice constants of these crystal were also identified.
引用
收藏
页码:474 / 481
页数:8
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