Die-bonding performance and mechanism based on the sintering of micro Ag paste for high power devices

被引：0

作者：

Takemasa, Tetsu ^{[1
]}

Ueshima, Minoru ^{[1
]}

Jiu, Jinting ^{[1
]}

Suganuma, Katsuaki ^{[2
]}

机构：

[1] Senju Met Ind Co Ltd, Adachi Ku, Senju Hashido Cho 23, Tokyo 1208555, Japan

[2] Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan

来源：

2016 IEEE 16TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO) | 2016年

关键词：

silver paste; loading pressure; contact; bonding pressure; shear strength; INTERMETALLIC COMPOUNDS GROWTH; INTERFACIAL REACTION; TEMPERATURE; SOLDER; SN;

D O I：

暂无

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Commercially available micron-sized Ag flake particles and submicron-sized Ag particles were used to make Ag paste. The Ag paste was used to connect Si dies to Ni-Ag plated Cu substrates to achieve die-bonding joint for high temperature application. The contact between die and Ag paste was affected by the loading pressure, and was realized with only 0.2 MPa pressure. And the shear strength depended on the bonding pressure and increased over 20 MPa with only 0.2 MPa pressure. The high shear strength achieved at low bonding pressure contributed to the tight contact between die and paste, and optimized bonding pressure.

引用

页码：377 / 380

页数：4

共 43 条

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[43] Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material
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