The role of copper twin boundaries in cryogenic indentation-induced grain growth

被引：21

作者：

Brons, J. G. ^{[1
]}

Hardwick, J. A. ^{[1
]}

Padilla, H. A., II ^{[2
]}

Hattar, K. ^{[2
]}

Thompson, G. B. ^{[1
]}

Boyce, B. L. ^{[2
]}

机构：

[1] Univ Alabama, Dept Met Engn, Tuscaloosa, AL 35487 USA

[2] Sandia Natl Labs, Albuquerque, NM 87185 USA

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2014年 / 592卷

关键词：

Microindentation; Grain growth; Twinning; Coincidence lattice; Precession enhanced diffraction; IN-SITU OBSERVATION; MOLECULAR-DYNAMICS; THIN-FILMS; DEFORMATION; STABILITY; RECOVERY; HARDNESS;

D O I：

10.1016/j.msea.2013.11.005

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Nanostructured Cu films with and without a high density of twins were indented at approximately 77 K with a load of 0.5 N. Utilizing precession-enhanced electron diffraction in the transmission electron microscope, the crystallographic texture, grain size, and grain-to-grain misorientation were quantified. In both orientations, the nanotwinned Cu underwent grain growth in the pile-up region of the indent, with the < 100 > oriented nanotwinned Cu having marked increases in the Sigma 3 and Sigma 5 boundary fractions as compared to the < 111 > orientated nanotwinned Cu. The Cu film without twin boundaries predominately experienced grain distortion and refinement. The twinned grain structure seems to facilitate the observed grain growth, either as a result of the increased mobility of the twin boundaries through a complex mechanically-induced detwinning mechanism and/or microstructure dependent dynamic recrystallization. (C) 2013 Elsevier B.V. All rights reserved.

引用

页码：182 / 188

页数：7

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