Strain induced grain boundary premelting along twin boundaries in copper polycrystals

被引：4
|
作者：
Inoko, F
Okada, T
Nishimura, T
Ohomori, M
Yoshikawa, T
机构：
[1] Univ Tokushima, Dept Mech Engn, Tokushima 7708506, Japan
[2] Niihama Natl Coll Technol, Dept Mech Engn, Niihama, Ehime 7920805, Japan
来源：
INTERFACE SCIENCE | 1999年 / 7卷 / 02期
关键词：
coherent twin boundaries; screw dislocation pile-up; strain induced grain boundary premelting; grain boundary cracks;
D O I：
10.1023/A:1008783602514
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A polycrystalline copper sample was compressed at room temperature, then the temperature was raised to 873 K in a vacuum and annealed without unloading. Grain boundary cracks were found at Sigma 3 coherent twin boundaries. The formation of these cracks can be interpreted based on the idea of strain induced grain boundary premelting (SIGBPM). It is emphasized that Sigma 3 twin boundaries can be one of the most dangerous boundaries for crack formation when certain experimental conditions are satisfied.
引用
收藏
页码：131 / 140
页数：10
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