Strain induced grain boundary premelting along twin boundaries in copper polycrystals

被引:4
|
作者
Inoko, F
Okada, T
Nishimura, T
Ohomori, M
Yoshikawa, T
机构
[1] Univ Tokushima, Dept Mech Engn, Tokushima 7708506, Japan
[2] Niihama Natl Coll Technol, Dept Mech Engn, Niihama, Ehime 7920805, Japan
关键词
coherent twin boundaries; screw dislocation pile-up; strain induced grain boundary premelting; grain boundary cracks;
D O I
10.1023/A:1008783602514
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A polycrystalline copper sample was compressed at room temperature, then the temperature was raised to 873 K in a vacuum and annealed without unloading. Grain boundary cracks were found at Sigma 3 coherent twin boundaries. The formation of these cracks can be interpreted based on the idea of strain induced grain boundary premelting (SIGBPM). It is emphasized that Sigma 3 twin boundaries can be one of the most dangerous boundaries for crack formation when certain experimental conditions are satisfied.
引用
收藏
页码:131 / 140
页数:10
相关论文
共 50 条
  • [21] Creep Fracture of Copper Tricrystal along Grain Boundaries
    Okada, Tatsuya
    Hisazawa, Hiromu
    Morimoto, Hiroki
    Nakao, Kazuki
    Okubo, Ryuta
    Ueki, Tomoyuki
    MATERIALS TRANSACTIONS, 2022, 63 (08) : 1133 - 1137
  • [22] Phase-field simulation of the coupled evolutions of grain and twin boundaries in nanotwinned polycrystals
    Yuanyuan Da
    Yuyang Lu
    Yong Ni
    Applied Mathematics and Mechanics, 2018, 39 : 1789 - 1804
  • [23] Phase-field simulation of the coupled evolutions of grain and twin boundaries in nanotwinned polycrystals
    Da, Yuanyuan
    Lu, Yuyang
    Ni, Yong
    APPLIED MATHEMATICS AND MECHANICS-ENGLISH EDITION, 2018, 39 (12) : 1789 - 1804
  • [24] Phase-field simulation of the coupled evolutions of grain and twin boundaries in nanotwinned polycrystals
    Yuanyuan DA
    Yuyang LU
    Yong NI
    AppliedMathematicsandMechanics(EnglishEdition), 2018, 39 (12) : 1789 - 1804
  • [25] Grain boundary evolution during low-strain grain boundary engineering achieved by strain-induced boundary migration in pure copper
    Yang, Xinye
    Wang, Peng
    Huang, Ming
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 833
  • [26] Twin boundary interactions with grain boundaries investigated in pure rhenium
    Kacher, Josh
    Minor, Andrew M.
    ACTA MATERIALIA, 2014, 81 : 1 - 8
  • [29] BEHAVIOR LIKE PREMELTING OF GRAIN-BOUNDARIES IN THIN FOILS OF ALUMINUM, COPPER, NICKEL AND BRASS
    INOKO, F
    TAGAMI, M
    YOSHIKAWA, T
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1990, 54 (04) : 493 - 494
  • [30] Dynamic twin nucleation at grain boundary in copper bicrystal
    Miura, H
    Sakai, T
    Mogawa, R
    Goffstein, G
    RECRYSTALLIZATION AND GRAIN GROWTH, PTS 1 AND 2, 2004, 467-470 : 1217 - 1222