An improved low-power low-noise dual-chopper amplifier for capacitive CMOS-MEMS accelerometers

被引:0
作者
Sun, Hongzhi [1 ]
Maarouf, Fares [1 ]
Fang, Deyou [1 ]
Jia, Kemiao [1 ]
Xie, Huikai [1 ]
机构
[1] Univ Florida, Dept Elect & Comp Engn, Gainesville, FL 32611 USA
来源
2008 3RD IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, VOLS 1-3 | 2008年
关键词
CMOS-MEMS accelerometer; three-axis accelerometer; dual-chopper amplifier; low power; low noise;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports an improved low-power low-noise dual-chopper amplifier (DCA) for capacitive CMOS-MEMS accelerometers. The new DCA employs an on-chip band-gap voltage reference to reduce the number of bonding pads and the complexity of the external circuits. The temperature drifting of the first-stage gain is reduced by using PMOS instead of NMOS as an active load. A prototype DCA with a three-axis accelerometer has been fabricated using the TSMC 0.35 mu m technology. The number of required bonding pads is reduced from 21 to 14, and the temperature sensitivity is reduced from 1.2 x 10(-3)/degrees C to 5.4 x 10(-4)degrees C.
引用
收藏
页码:1075 / 1080
页数:6
相关论文
共 16 条
[1]  
*AN DEV, 2004, ADXL103 ADXL203 SING
[2]   A CMOS nested-chopper instrumentation amplifier with 100-nV offset [J].
Bakker, A ;
Thiele, K ;
Huijsing, JH .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2000, 35 (12) :1877-1883
[3]  
CHAU KHL, 1995, P 8 INT C SOL STAT S, V9, P593
[4]   A temperature-dependent MOSFET inversion layer carrier mobility model for device and circuit simulation [J].
Cheng, BH ;
Woo, J .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1997, 44 (02) :343-345
[5]  
FANG D, 2006, P 2006 S VLSI CIRC H, P76
[6]  
Fedder GK., 1994, Simulation of microelectromechanical systems
[7]  
*FREESC SEM, 2005, 1 5G 6G 3 AX LOWG MI
[8]   Single-chip surface micromachined integrated gyroscope with 50°/h allan deviation [J].
Geen, JA ;
Sherman, SJ ;
Chang, JF ;
Lewis, SR .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2002, 37 (12) :1860-1866
[9]  
Gopel W., 1994, SENSORS COMPREHENSIV, V7
[10]  
Jiang X, 2002, P SOL STAT SENS ACT, P202