Fatigue Strength around Through Hole in Printed Circuit Board

被引:0
作者
Kinoshita, Takahiro [1 ]
Iwade, Shogo [1 ]
Shima, Shunpei [1 ]
Kawakami, Takashi [1 ]
Mizushina, Hideki
Iinaga, Hiroshi
机构
[1] Toyama Prefectural Univ, 5180 Kurokawa, Toyama 9390398, Japan
来源
2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2013年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:238 / 240
页数:3
相关论文
共 10 条
  • [1] [Anonymous], 2009, J JAPAN I ELECT PACK
  • [2] Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package
    Kinoshita, Takahiro
    Kawakami, Takashi
    Hori, Tatsuhiro
    Matsumoto, Keiji
    Kohara, Sayuri
    Orii, Yasumitsu
    Yamada, Fumiaki
    Kada, Morihiro
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2012, 134 (02)
  • [3] Matsumoto K., 2009, T JAPAN I ELECT PACK, V2, P153
  • [4] Nishiki S., 2010, HYOMENGIJUTSU, V61, P362
  • [5] Oyamada K., 2003, J JAPAN I ELECT PACK, V16, P228
  • [6] Shao-Ping Shen, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), P186, DOI 10.1109/IMPACT.2009.5382146
  • [7] Singh SG, 2009, INT MICRO PACK ASS, P162
  • [8] Takagi K., 2008, HYOMENGIJUTSU, V59, P570
  • [9] Takata Y., 1994, J OD JAPAN I ELECT P, V9, P199
  • [10] Tamiya Y., 2011, J SOC MATER SCI JPN, V60, P777