Fatigue Strength around Through Hole in Printed Circuit Board

被引：0
作者：
Kinoshita, Takahiro [1 ]
Iwade, Shogo [1 ]
Shima, Shunpei [1 ]
Kawakami, Takashi [1 ]
Mizushina, Hideki
Iinaga, Hiroshi
机构：
[1] Toyama Prefectural Univ, 5180 Kurokawa, Toyama 9390398, Japan
来源：
2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2013年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：238 / 240
页数：3
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